Effects of Cutting Edge Truncation on Ultrasonically Assisted Grinding

Keisuke Hara; Hiromi Isobe; Akira Kyusojin

doi:10.4028/www.scientific.net/KEM.389-390.368

Paper Titles

Spatial Distribution of Cooling Mist for Precision Grinding
p.344

A Truing Technique of Flattening Diamond Grains for Fabricating Microstructures with Fine Surfaces
p.350

The Possibility of Dressless Restoration of Grindactivity in Dry Grinding of Carbon
p.356

Virtual Truing and Dressing of Grinding Wheel
p.362

Effects of Cutting Edge Truncation on Ultrasonically Assisted Grinding
p.368

A Preliminary Study of the Erosion Process in Micro-Machining of Glasses with a Low Pressure Slurry Jet
p.375

Hole Machining of Glass by Micro Abrasive Suspension Jets
p.381

Simulation and Analysis of Abrasive Jet Machining with Wheel Restriction in Grinding
p.387

Profit Optimization of Abrasive Blasting Systems
p.392

HomeKey Engineering MaterialsKey Engineering Materials Vols. 389-390Effects of Cutting Edge Truncation on...

Effects of Cutting Edge Truncation on Ultrasonically Assisted Grinding

Abstract:

High precision mold grinding technique to obtain mirror surface is required which realizes minimization or omission of final polishing by skilled workers. In the previous reports, ultrasonically diamond grinding experiments were carried out to confirm ultrasonically oscillation effect for die steel face grinding. Mirror surface was obtained successfully and little abrasive worn out was found. In the above technique, the cutting edge shape of a tool affects the ground surface resulting from transcription of cutting edge. In other words, cutting edge truncation of grinding tool is required to be smooth and glossy surface. This paper describes the cutting edge truncation of diamond electroplated tools which are used in ultrasonically assisted grinding. Experiments were carried out to confirm truncation effects on the ground surface and grinding force. It was confirmed that cutting edge truncation is effective method to obtain mirror surface and excessive truncation causes large grinding force and chattering.

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Periodical:

Key Engineering Materials (Volumes 389-390)

Pages:

368-374

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.389-390.368

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Online since:

September 2008

Authors:

Keisuke Hara, Hiromi Isobe, Akira Kyusojin

Keywords:

Cutting Edge Truncation, Diamond Electroplated Tool, Mirror Surface Finishing, Ultrasonically Assisted Grinding

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References

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