HOME
CONTACT
Username:
Password:
FULLTEXT SEARCH
NEW:
Advanced Search
MSF
>
Materials Science Forum
KEM
>
Key Engineering Materials
SSP
>
Solid State Phenomena
DDF
>
Defect and Diffusion Forum
AMM
>
Applied Mechanics and Materials
AMR
>
Advanced Materials Research
AST
>
Advances in Science and Technology
JNanoR
>
Journal of Nano Research
JBBTE
>
Journal of Biomimetics, Biomaterials, and Tissue Engineering
JMNM
>
Journal of Metastable and Nanocrystalline Materials
> @scientific.net
CONFERENCE
10/18/2009 - 10/19/2009
APCCC-15: 15. Asian-Pacific corrosion control conference
6/28/2009 - 7/3/2009
ICMAT 5
4/25/2009 - 4/28/2009
ICPMT09: 9. International Conference on Progress of Machining Technology
more...
>
CLICK for guided search
Biomaterials
Biotechnology
Ceramics & Oxides
Composites
Corrosion & Oxidation
Defects & Diffusion
Deformation & Fracture
Earth Sciences
Environmental Research
Intermetallics
Light Metals
Magnetic Materials
Mechanics
Mechatronic
Metals and Alloys
Molten Salts
Nanomaterials
Polymers & Plastics
Semiconductors
Silicon Carbide
Steels
Surfaces & Interfaces
Textures & Anisotropy
Thin Films
>
CLOSE
Bending Fatigue Characteristic of Sn-3.5Ag Solder Bump on Ni-UBM
doi:10.4028/0-87849-383-2.177
Get the full paper by clicking here
Username:
Password:
