Paper Titles
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Preface
Progress of Research in Slicing Technology of Large-Scale Silicon Wafers
p.1
The Analysis on Movement of the Charged Particles in a Magnetic-Electrochemical Compound Polishing
p.6
Study on Brittle-Ductile Transition Mechanism of Ultra-Precision Turning of Single Crystal Silicon
p.11
Initiation and Propagation Laws of Glass Cracks in Specimens under the Action of Cylindric Indenter Subjected to Normal Load
p.17
Large Plastic Deformation and Ultra-Fine Grained Structures Generated by Machining
p.21
Mechanism of Chip Deformation in Orthogonal Cutting the Wheel Steel
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The Influence of Tool Edge Radius on Size Effect in Orthogonal Micro-Cutting Process of 7050-T7451 Aluminum Alloy
p.31

Progress of Research in Slicing Technology of Large-Scale Silicon Wafers

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Abstract:

This paper introduces and summarizes the slicing technology of large-scare silicon wafers. And the research status of ID slicing, wire saw slicing and WEDM is summed up. Finally, this document indicates the direction of research and the development.

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Periodical:

Key Engineering Materials (Volumes 375-376)

Pages:

1-5

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.375-376.1

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Online since:

March 2008

Authors:

Li Gang Zhao, Dun Wen Zuo, Yu Li Sun

Keywords:

Fixed Abrasive Multi-Wire Saw, Free Abrasive Multi-Wire Saw, ID Slicing, Silicon Wafer, WEDM

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© 2008 Trans Tech Publications Ltd. All Rights Reserved

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