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Progress of Research in Slicing Technology of Large-Scale Silicon Wafers
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The Analysis on Movement of the Charged Particles in a Magnetic-Electrochemical Compound Polishing
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Study on Brittle-Ductile Transition Mechanism of Ultra-Precision Turning of Single Crystal Silicon
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Large Plastic Deformation and Ultra-Fine Grained Structures Generated by Machining
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Study on Brittle-Ductile Transition Mechanism of Ultra-Precision Turning of Single Crystal Silicon

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Abstract:

According to the size effect theory established on the concept of geometrically necessary dislocations and results of nano-indentation experiments, a novel brittle-ductile mechanism of ultra-precision turning of single crystal silicon is proposed. The accurate critical chip thickness is firstly calculated on the basis of theoritical analysis. A macro-micro cutting model is created based on the brittle-ductile transition mechanism. Finally, the results of study are testified through experiments.

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Periodical:

Key Engineering Materials (Volumes 375-376)

Pages:

11-16

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.375-376.11

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Online since:

March 2008

Authors:

Ming Hai Wang, Ze Sheng Lu

Keywords:

Brittle-Ductile Transition, Cutting Model, Single Crystal Silicon, Ultra-Precision Turning

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© 2008 Trans Tech Publications Ltd. All Rights Reserved

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