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Joining of Gamma-Based Titanium Aluminides – A Review

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Abstract:

The optimisation of joining technologies is essential to the application of advanced materials in the design of parts and devices. The development of intermetallic compounds, as structural materials, inevitably requires a new approach to join these compounds to themselves or to other materials. Among different intermetallic classes, titanium aluminides are one of the most studied. However, the industrial application is far from being proportional to the research, due to different problems, where joining processes have an important role. The present paper highlights the state of art on joining γ-TiAl alloys. A review is presented with special emphasis on solid-state diffusion bonding process, because it seems to be the most suitable technique to produce high quality joints of advanced materials. The influence of the bonding conditions on the physical and mechanical properties of the joints is highlighted and the introduction of single or multiple interlayers to assist in the bonding process is discussed. A novel approach developed by the authors to the solid-state diffusion bonding of γ-TiAl alloys using Ti/Al multilayer thin films as bonding materials is proposed. The improvement of the solid-state diffusion bonding will induce sound joints at lower temperatures or pressures.

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Periodical:

Materials Science Forum (Volumes 514-516)

Pages:

483-489

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.514-516.483

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Online since:

May 2006

Authors:

Ana Sofia Ramos, Maria-Teresa Freire Vieira, Manuel F. Vieira, Filomena Viana

Keywords:

Diffusion Bonding (DB), Gamma-Based Titanium Aluminides, Interlayers, Multilayer Thin Films

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© 2006 Trans Tech Publications Ltd. All Rights Reserved

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