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Passivation Cracking Analyses of Micro-Structures of IC Packages

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Abstract:

The passivation cracking of Micro-structures of IC packages is studied by maximum principal stress theory using a certain 2D FEM model with different design parameters, pitch of lines, width of line, thickness of epoxy, thickness of dielectric layer, thickness of glue, the glue material’s yielding stress and Aluminium yielding stress (following as “d”, “w”, “t_epo”, “t_Teos”, “t_glue” “sy_glue” and “sy_al” respectively). For different critical process steps, the final process temperature is acted as a representative parameter to analyze its impact. Furthermore, Response Surface Model (RSM) of principal stress is established using any two design parameters. Results show that “d”, “w”, “t_epo”, “sy_glue” and “sy_al” will have great influence on passivation cracking while “t_Teos” have a little impact.

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Periodical:

Key Engineering Materials (Volumes 324-325)

Pages:

515-518

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.324-325.515

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Online since:

November 2006

Authors:

Yu Ting He, Hong Peng Li, Rong Shi, Feng Li, G.Q. Zhang, L.J. Ernst

Keywords:

Maximum Principal Stress, Package, Passivation Crack, Response Surface Model

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© 2006 Trans Tech Publications Ltd. All Rights Reserved

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References

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