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Microfabrication of Polymers Using KrF Excimer Laser Beam

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Abstract:

Pulsed UV laser beams, which are widely used in the processing of polymers, offer many advantages in the field of polymer production, primarily because their photon energy is higher than the binding energy of the polymer. In particular, the fabrication of polymers with an excimer laser process is faster and more convenient than with other processes. Nevertheless, some problems occur in the precision microprocessing of polymers, including the formation and deposition of surface debris, which is produced from the breakdown of either polymer chains or radical bonds. In the present work, a process for eliminating carbonized surface debris contamination generated by the laser ablation of a polymer was developed. The proposed approach for removing surface debris utilizes an erasable ink pasted on the polymer. The surface debris ejected from the polymer is then combined with the ink layer on the polymer. Finally, both the surface debris and the ink layer can be removed using adhesive tape.

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Periodical:

Key Engineering Materials (Volumes 326-328)

Pages:

115-118

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.326-328.115

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Online since:

December 2006

Authors:

Dong Sig Shin, Jae Hoon Lee, Jeong Suh

Keywords:

Ablation, Debris-Free Process, Erasable Ink, Excimer Laser, Polyimide, Polymer, Surface Debris

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© 2006 Trans Tech Publications Ltd. All Rights Reserved

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