Dynamic ESPI System for Spatio-Temporal Strain Analysis of a Deforming Solid Object

Tomohisa Shiraishi; Satoru Toyooka; Hirofumi Kadono; Takayuki Saito; Sun Ping

doi:10.4028/www.scientific.net/KEM.326-328.95

Paper Titles

Strain Analysis on Porous TiNi SMA Using SEM Moiré Method
p.79

Image Reconstruction from Incomplete Data and Its Applications in Experimental Mechanics
p.83

Characterization of Multipoint Diffraction Strain Sensor (MISS)
p.87

Calibration of Displacement Sensors with High-Precision and Large Measurement Range Using Temporal Speckle Pattern Interferometry
p.91

Dynamic ESPI System for Spatio-Temporal Strain Analysis of a Deforming Solid Object
p.95

Digital Speckle Projection for Vibration Measurement by Applying Digital Image Correlation Method
p.99

Practical Application of Picosecond Laser Micro-Machining to the Direct Fabrication of a Diffraction Grating Mold
p.103

Modification of the Curing Characteristics of the Photocurable Resin FA1260T for 3D Microfabrication Using Microstereolithography
p.107

Fabrication of Superfine Electron Moiré Grid
p.111

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Dynamic ESPI System for Spatio-Temporal Strain Analysis of a Deforming Solid Object

Abstract:

In Dynamic Electronic Speckle Pattern Interferometry (DESPI), deformation analysis could be done for successively acquired frame data of interfering speckle patterns with no additional frames like phase shifting speckle patterns. Our final goal is to obtain a temporally varying process of two-dimensional strain field. Two normal strains and shearing strain are derived by numerical derivatives of two components of in-plane deformation. Analyzed results of tensile experiments of an Al-alloy sample will be shown. In the experiments, propagation of a strain localization band accompanied by serration of a stress curve was clearly observed quantitatively analyzed.