Nano-Structures Fabrication by Laser Combined with Near-Field Scanning Optical Microscopy

Dong Jiang Wu; Juan Zhuang; Xu Yue Wang; Ren Ke Kang; Fu Ling Zhao

doi:10.4028/www.scientific.net/KEM.329.415

Paper Titles

Material Removal Mechanisms Involved in Rotary Ultrasonic Machining of Brittle Materials
p.391

Numerical Simulation and Prediction of Surface Heterogeneity in Diamond Turning of Single-Crystalline Germanium
p.397

A Finite Element Analysis of Stress Fields in Vickers Indentation on Brittle Materials
p.403

Critical Cutting Condition for Brittle-Ductile Transition of KDP Crystals in Ultra-Precision Machining
p.409

Nano-Structures Fabrication by Laser Combined with Near-Field Scanning Optical Microscopy
p.415

Ceramic Grindability Evaluation with PCA Method
p.421

Analysis of Mechanical Property of Crystal KDP and Simulation of Ultra-Precision Cutting Process in the Ductile Mode
p.427

Experimental Investigation of Brittle to Ductile Transition of Single Crystal Silicon by Single Grain Grinding
p.433

A New Complex Grinding Method for Ceramic Materials Combined with Ultrasonic Vibration and Electrodischarge Machining
p.439

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Nano-Structures Fabrication by Laser Combined with Near-Field Scanning Optical Microscopy

Abstract:

We have developed the laser nanoprocessing technique by the integration of the fs laser and near-field scanning microscopy (NSOM). The second harmonic femtosecond laser working in the optical near-field with the assistance of NSOM equipment was applied to expose the photosensitive polymer material. The nanopatterns with feature size smaller than the laser wavelength can be fabricated. The optical diffraction limitation is therefore broken through by the near-field nanoprocessing. It was found in our experiment that the nanofabrication feature size depends strongly on the gap between the fiber probe tip and the substrate surface, as well as the laser coupling efficiency. The approach offers the advantages of high precision, speed and selectivity in nanopatterning, and is promising to be used in data storage device manufacture for higher density recording.