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Interfacial Reaction of Cu/Sn-Ag/ENIG Sandwich Solder Joint during Aging

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Abstract:

The interaction between Cu/Sn-Ag and Sn-Ag/Ni interfacial reactions has been studied during isothermal aging at 150°C for up to 1000h using a Cu/Sn-3.5Ag/ENIG sandwich solder joint. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer formed at the upper Sn-Ag/Cu interface after reflowing. On the other hand, a (Cu,Ni)6Sn5 IMC layer was observed at the Sn-Ag/ENIG interface. The Cu in the (Cu,Ni)6Sn5 IMC layer formed on the Ni side has to be contributed from the dissolution of the opposite Cu metal pad or Cu-Sn IMC layer. When the dissolved Cu arrived at the interface of the Ni pad, the (Cu,Ni)6Sn5 IMC layer formed on the Ni interface, preventing the Ni pad from reacting with the solder. Although a long isothermal aging treatment at 150°C was performed, any Ni was not detected in the Cu-Sn IMC layer formed on the Cu side. Compared to the single Sn-Ag/ENIG solder joint, the formation of the (Cu,Ni)6Sn5 IMC layer of the Cu/Sn-Ag/ENIG sandwich joint retarded effectively the consumption of the Ni from the electroless Ni-P layer.

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Periodical:

Advanced Materials Research (Volumes 15-17)

Pages:

1001-1007

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.15-17.1001

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Online since:

February 2006

Authors:

Jeong Won Yoon, Seung Boo Jung

Keywords:

Aging Treatment (AT), Electroless Nickel-Immersion Gold (ENIG), Interfacial Reaction, Pb-Free Solder, Sn-Ag Solder

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© 2007 Trans Tech Publications Ltd. All Rights Reserved

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References

[1] J.W. Yoon and S.B. Jung: Mater. Sci. Forum Vol. 510-511 (2006), p.554.

Google Scholar

[2] M. Abtew and G. Selvaduray: Mater. Sci. Eng. R. Vol. 27 (2000), p.95.

Google Scholar

[3] K. Zeng and K.N. Tu: Mater. Sci. Eng. R. Vol. 38 (2002), p.55.

Google Scholar

[4] J.W. Yoon, S.W. Kim, J.M. Koo, D.G. Kim and S.B. Jung: J. Electron. Mater. Vol. 33 (2004), p.1190.

Google Scholar

[5] J.W. Yoon, S.W. Kim and S.B. Jung, J. Alloys Compd. Vol. 391 (2005), p.82.

Google Scholar

[6] J.W. Yoon, S.W. Kim and S.B. Jung, J. Alloys Compd. Vol. 392 (2005), p.247.

Google Scholar

[7] S.J. Wang and C.Y. Liu: J. Electron. Mater. Vol. 32 (2003), p.1303.

Google Scholar

[8] J.W. Yoon, C.B. Lee, D.U. Kim and S.B. Jung, Metals and Materials International Vol. 9 (2003), p.193.

Google Scholar

[9] J.W. Yoon, C.B. Lee and S.B. Jung: J. Electron. Mater. Vol. 32 (2003), p.1195.

Google Scholar