Paper Titles
Behavior of Boron in 9Cr Heat Resistant Steel during Heat Treatment and Creep Deformation
p.569
Superplasticity of Nanocrystalline ZrO2-Spinel Composite
p.573
Super Plastic Flow and Cosmic Micromechanics
p.577
Accommodation of Grain Boundary Sliding in AZ31 Alloy
p.581
Creep Rupture of Sn-Ag-Cu Pb-Free Solder Alloy
p.585
Creep Curve Modeling of Hastelloy-X Alloy by Using the Nonlinear Regression Method in the Kachanov-Rabotnov Creep Model
p.589
A study of Carbon and Nitrogen Free New Alloys with Superior Creep Properties More over 700°C
p.593
Superplastic Behavior of Ultrafine Grained Al Alloys Fabricated by Severe Plastic Deformation
p.597
Effect of Powder Particle Sizes on the Development of Ultra Hard Surface through Superplastic Boronizing of Duplex Stainless Steel
p.601

Creep Rupture of Sn-Ag-Cu Pb-Free Solder Alloy

Article Preview

Abstract:

The eutectic Sn3.8Ag0.7Cu alloy is widely considered a leading Pb-free replacement for the eutectic Pb-Sn solder alloy in electronic packaging where creep deformation and rupture is a major concern. In this study, creep rupture behavior of Sn-Ag-Cu solder alloy was investigated under the isothermal condition. Creep tests were conducted under a range of stresses and temperatures. Creep lifetime data were analyzed by the combined time-temperature equations following the Sherby, Larsen-Miller, and Manson-Haferd approaches. From these analyses, a series of material parameters were obtained from the experimental data. The results showed that the Manson-Hanferd method provided a better correlation with the creep rupture data. The mechanisms of creep deformation and rupture at different time-temperature combinations are discussed.

You might also be interested in these eBooks
The Mechanical Behavior of Materials X View Preview

Info:

Periodical:

Key Engineering Materials (Volumes 345-346)

Pages:

585-588

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.345-346.585

Citation:

Cite this paper

Online since:

August 2007

Authors:

L. Zhang, Zhong Guang Wang, J.K. Shang

Keywords:

Creep Rupture, Parametric Methods, Pb-Free Alloy, Sn3.8Ag0.7Cu

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2007 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

References

[1] K. Zeng, K. N. Tu. Mater. Sci. Eng R, Vol. 38(2002), p.55.

Google Scholar

[2] J. Glazer. Inter Mater Rev, Vol. 40(1995), p.65.

Google Scholar

[3] J. Yu, D. K. Joo, and S. W. Shin. Acta Mater, Vol. 50(2002), p.4315.

Google Scholar

[4] S.S. Manson, C. R. Ensign. ASME J. Eng Mater &Tech, Vol. 101(1979), p.317.

Google Scholar

[5] E. Pink. Mater Sci & Tech, Vol. 10(1994), p.340.

Google Scholar

[6] Orr, Sherby, and Dorn. Trans. ASM, Vol. 46(1954), p.113.

Google Scholar

[7] S. S. Manson, A. Mendelsohn. NASA Memorandum, n. 3-10-59E(1959), p.1.

Google Scholar

[8] M. Kerr, N. Chawla. Acta Materialia, Vol. 52(2004), p.4527.

Google Scholar

[9] I. Dutta, C. Park, and S. Choi. Mater Sci Eng A, Vol. 379(2004).

Google Scholar