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Fatigue Properties of Nanometer-Scale Copper Films

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Abstract:

Fatigue tests of nanometer-thick Cu films as deposited and annealed in vacuum were conducted under constant load ranges at room temperature. Fatigue strengths of the Cu films, which is defined as the critical load range being able to cause crack initiation within 106 cycles, are determined. The experimental results show that fatigue strength increases with decreasing film thickness. Fatigue cracking behaviors were characterized by electron microscope. It is also found that fatigue cracking resistance is dependent on film thickness and increases with decreasing film thickness. Size effects on fatigue properties of the nanometer-thick Cu films are discussed.

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Periodical:

Key Engineering Materials (Volumes 353-358)

Pages:

116-119

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.353-358.116

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Online since:

September 2007

Authors:

Bin Zhang, K.H. Sun, Jun Gong, C. Sun, Zhong Guang Wang, G.P. Zhang

Keywords:

Copper Films, Fatigue Property, Nanometer-Scale

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© 2007 Trans Tech Publications Ltd. All Rights Reserved

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