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The Characteristic of Organic Bond Grinding Wheel

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Abstract:

The bond in a grinding wheel cements the abrasive grains together, Among other factors, the bond plays a predominant part in the grinding wheel performances and on the quality of grinding results. This paper presents a literature review on organic bond grinding wheels. It discusses the characteristic of the bond and the grinding performances of the two mainly types of organic bond [1] grinding wheels: the resin bond grinding wheel and the soft-elastic grinding wheel. This paper provide a conclusion of the studying state of organic grinding wheel, which new studying can draw lesson from.

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Periodical:

Key Engineering Materials (Volumes 359-360)

Pages:

63-67

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.359-360.63

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Online since:

November 2007

Authors:

Mei Wei Chen, Ju Long Yuan, Yi Yang, Dong Qiang Yu

Keywords:

Bond, Grinding Performance, Organic Bond Grinding Wheel

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© 2008 Trans Tech Publications Ltd. All Rights Reserved

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References

[1] V.P. Alphonsus: Adhension and Adhensives Technology--An Introduction (Carl Hanser Verlag, USA 2002).

Google Scholar

[2] M.J. Jackson, B. Mills and M.P. Hitchner: Proceedings of Engineering Sciences, Vol. 28 (2003), pp.897-914.

Google Scholar

[3] E. Bright and M. Wu: U.S. Patent 6, 679, 758. (2004).

Google Scholar

[4] J. Kopac and P. Krajnik: Journal of Materials Processing Technology, Vol. 175 (2006), pp.278-284.

Google Scholar

[5] J.H. Liua, Z.J. Pei and G.R. Fisherb: International Journal of Machine Tools and Manufacture, Vol. 47 (2007) No. 1, pp.2-17.

Google Scholar

[6] http: /www. ilo. org.

Google Scholar

[7] http: /www. mmsonline. com.

Google Scholar

[8] Y.Q. Wang and W. Peng: The Research of Photocureable Resin Ultrathin Abrasive Cut-off Wheel (MS. Dissertation, Zhejiang University of Technology, China 2005), pp.2-7. (In Chinese).

Google Scholar

[9] S.X. Xu: Superhard Material and Engineering, (2001) No. 3, pp.11-18. (In Chinese).

Google Scholar

[10] S.Y. Luo, Y.C. Liu, C.C. Chou and T.C. Chen: Journal of Materials Processing Technology, Vol. 118 (2001), pp.329-336. (In Chinese).

Google Scholar

[11] X.T. Xu: Jewelry Science and Technology, Vol. 58 (2004) No. 6, pp.16-19. (In Chinese).

Google Scholar

[12] Z.M. Wang: Stone, (2000) No. 2, pp.11-19. (In Chinese).

Google Scholar

[13] G. Li: Journal of Southwest China Normal University, Vol. 31 (2006) No. 2, pp.60-63. (In Chinese).

Google Scholar