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Advances in Abrasive Technology VI

Key Engineering Materials Volumes 257 - 258

• Papers
• Abstracts

• p3 Chip Formation Behaviour in Ultra-Precision Cutting of Electroless Nickel Plated Mold Substrates   [ 4 M ]
  Authors: Ji Wang Yan, Takeo Sasaki, Jun'ichi Tamaki, Akihiko Kubo, T. Sugino
• p9 A Controlled Atmosphere Cutting Apparatus for Understanding Tribological Behavior of Lubricants in Near-Dry Machining   [ 333 K ]
  Authors: K. Hayashi, I. Inasaki, T. Wakabayashi, S. Suda, Shinya Suzuki, H. Yokota, Tomohiro Aoyama, M. Nakamura
• p15 Brittle-Ductile Transition in Nano Bending of Monocrystalline Silicon Carbide Analyzed by Molecular Dynamics Simulation   [ 819 K ]
  Authors: Hiroaki Tanaka, M. Sano, Shiro Shimada
• p21 Molecular Dynamics Analysis of Ultra High-Acceleration and Vibration Cutting   [ 434 K ]
  Authors: Jun Shimizu, H. Tanaka, L. Zhou, Hiroshi Eda
• p27 Abrasive Nanometric Machining: Modelling, Simulation and its Application Promise   [ 212 K ]
  Authors: X.C. Luo, K. Cheng
• p33 A Study of the Molecular Dynamics Simulation in Nanometric Grinding   [ 251 K ]
  Authors: Ren Ke Kang, X.G. Guo, Dong Ming Guo, Zhu Ji Jin
• p39 Measurement and Analysis of AFM-Based Nano-Indentation on Micro-Machined Silicon Surface   [ 588 K ]
  Authors: Qing Liang Zhao, Ming Jun Chen, Ying Chun Liang, Shen Dong, K. Cheng
• p45 A Novel FEA Model for the Integral Analysis of a Machine Tool and Machining Processes   [ 330 K ]
  Authors: D. Huo, K. Cheng, D. Webb, F. Wardle
• p51 Influence of the Static Stiffness of Grinding System on the Generation of Affected Layers   [ 614 K ]
  Authors: S. Yokoyama, H.S. Lee, T. Yamada
• p57 Geometric Models of the Ultra-Precision Grinding for Large Non-Axisymmetric Optical Aspheric Surfaces   [ 176 K ]
  Authors: Cheng Shun Han, Shen Dong, Y.Y. Tang