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Investigation on the Electromagnetic Contactless Shaping and Directional Solidification of Plates of Stainless Steel and Supperalloy under Vacuum
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Microstructural Evolution of Undercooled Ni-40wt%Pb Hypermonotectic Alloy
p.2651
Electromigration Induced Metal Dissolution in Flip-Chip Solder Joints
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Effect of Material Properties on the Plastic Straining Capacity of Defective Welds
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Microstructural Evolution of Undercooled Ni-40wt%Pb Hypermonotectic Alloy

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Abstract:

Microstructural evolution of bulk undercooled Ni-40wt%Pb hypermonotectic alloy was systematically investigated by using molten glass purification and superheating cycling. Within the achieved undercooling range, the microstructures were classified into three categories. When the undercooling was less than 50K, the microstructure consisted of coarse dendritic grain and interdendritic Pb lumps. Increasing undercooling to the range 100 to 198K, macrosegregation was serious. When the undercooling was up to 292K, refined granular grain with homogeneously distributed fine Pb particles on it formed. The granulation mechanism of granular grains was owing to dendritic disintegration and subsequent recrystallization.

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Periodical:

Materials Science Forum (Volumes 475-479)

Pages:

2651-2654

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.475-479.2651

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Online since:

January 2005

Authors:

Hong Xing Zheng, Yun Yu, Jian Guo Li

Keywords:

Granulation Mechanism, Ni-Pb Hypermonotectic Alloy, Undercooling

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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