Deformation and Recrystallization Texture of Heavily Drawn OFHC Copper

Daudi R. Waryoba; Peter N. Kalu

doi:10.4028/www.scientific.net/MSF.495-497.877

Paper Titles

Texture of Al-Cu Alloys Deformed by ECAP
p.851

Equal Channel Extrusion Heterogeneities in Recrystallized Copper
p.857

Analysis of Textures of Wires Drawn in Pressure and Roller Dies with ODF
p.865

Variance of the Grain Boundary Character Distribution
p.871

Deformation and Recrystallization Texture of Heavily Drawn OFHC Copper
p.877

The Role of Microstructural Aspects on the Performance of Coarse-Grained Superplastic Al Alloys
p.883

Effect of Thermomechanical Treatment on the Texture Evolution and Superplasticity of a Zn-0.3wt.% Al Alloy
p.889

Textural and Microstructural Inhomogeneities in Drawn and Annealed OFHC Copper Wire
p.895

Microtexture Analysis of Friction Stir Welded Al 6061-T651 Plates
p.901

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Deformation and Recrystallization Texture of Heavily Drawn OFHC Copper

Abstract:

Deformation and recrystallization texture has been investigated in Oxygen free high conducting (OFHC) copper wires drawn at room temperature to true strain of 2.31, and isothermally annealed at various temperatures between 150°C and 750°C. Local orientations of the microstructures were measured by means of electron backscattered diffraction (EBSD) technique. While the drawn wire was characterized by a major<111> + minor<100> duplex fiber texture, recrystallization occurred at annealing temperatures between 250°C and 400°C and resulted into a major<100>+minor<111> recrystallization texture. At temperatures above 500°C, the <100> dominated recrystallization texture changed to the <111> dominated growth texture due to secondary recrystallization, which favored the <111> orientation at the expense of the <100> component.