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Sputter-Deposited Cr as an Alternative to Electroplated Cr

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Abstract:

Since the hexavalent chromium used in chromium electroplating was found to cause cancer in human body, alternative deposition techniques have been widely investigated. Sputter deposition of chromium (Cr) as a deposition technique for replacing electroplating was studied. Effects of RF-power, substrate temperature on the deposition rate, corrosion-resistance, hardness and adhesion strength were investigated. X-ray diffraction (XRD) analysis was performed to determine the structure and the compositions of the films. The hardnesses of the films were measured by using a nanoindenter. The microstructures of the films were observed using scanning electron microscopy. The deposition rate and hardness of the sputter-deposited Cr film tend to increase with the increasing RF-power and substrate temperature of the sputtering process. Both the hardness and adhesion strength of the sputter-deposited chromium film was found to be higher than those of the electroplated chromium film.

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Periodical:

Materials Science Forum (Volumes 510-511)

Pages:

674-677

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.510-511.674

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Online since:

March 2006

Authors:

Chong Mu Lee, Kyung Ha Kim, Jong Min Lim

Keywords:

Adhesion Strength, Chromium, Deposition Rate, Hardness, Sputtering

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© 2006 Trans Tech Publications Ltd. All Rights Reserved

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