Materials Science Forum Vol. 512

Abstract: Sn-3.5Ag (Sn-Ag) and Sn-3.5Ag-0.75Cu (Sn-Ag-Cu) solder balls were reflowed on electroless Ni-P/Au plated Cu pad with varying thickness of Au layer (0 to 500nm). In the Sn-Ag solder joint, a P-rich layer including voids, which resulted from Ni diffusion from the Ni-P plating to form Ni3Sn4 interfacial reaction layer, formed at the interface regardless of Au plating thickness. This caused the degradation of the joint strength. On the contrary, the Sn-Ag-Cu solder joint had no continuous P-rich layer formed and showed a higher joint strength than the Sn-Ag solder joint in the case of Au plating of 50nm or less. Cu alloying to the solder promote the formation of (Cu, Ni)6Sn5 instead to Ni3Sn4 as the interfacial reaction layer. The (Cu, Ni)6Sn5 reaction layer can suppress the diffusion of Ni from the N-P plating and thereby inhibit the formation of the P-rich layer. However, in the case of thick Au plating of 250nm or more, a thin P-rich layer formed at the interface even in the Sn-Ag-Cu solder joint and the joint strength was degraded. Au dissolving into the solder from the Au plating during the reflow process may encourage the diffusion of Ni from the Ni-P plating into the solder. As a result, the Sn-Ag-Cu solder joints with 50nm Au coating provided the best joint strength, although its joint strength considerably degraded after the aging treatment at 423K.

Abstract: The reaction between the zinc plate (ZP) and the IF steel with near surface ultra fine grains (NSUFG) structure with grain size of about 89 nm was studied in temperature range of 473K to 623K in order to elucidate the temperature dependence of the reactions and its mechanism, by comparison with the reactions of ZP to coarse grains (CG) sheet, superficial cold rolled CG sheet (CG+R) and superficial cold rolled NSUFG sheet (NSUFG+R). It was found that this NSUFG structure considerably affected reactions between IF steel and ZP. There was almost no effect of superficial cold rolling on their reactions, but the NSUFG structure dramatically enhanced the reactions. The incubation times for appearance of the reaction layer and its layer width of ZP /(NSUFG or NSUFG+R) reactions are shorter and thicker than those of the ZP/(CG or CG+R) ones. The activation energy for reaction was 107kJ/mol, which indicates that the volume diffusion in zinc side and the grain boundary diffusion in the iron side play an important role in the reaction. The layer growth up to the layer thickness less than about 10µm was controlled mainly by the interface reaction and it over about 10µm mainly by the diffusion mass transfer.

Abstract: The novel selective interconnection using the resin containing low-melting-point-alloy fillers was developed as a high density assembly method of a low-temperature and highly reliable electronic interconnection. By means of the coalescence of fillers and wetting onto the terminal material due to the Laplace pressure of the fillers, self-organization onto the terminals was formed. The influence of the filler volume ratio and resin viscosity on the self-organized interconnecting was investigated by the numerical analysis with a multi-filler dispersion model corresponding to a real process, and was evaluated by using the normalized parameter (self-organization ratio). We clarified the existence of the optimal value of the filler volume ratio. The rate controlling factor transferred from the filler volume to the inflow velocity by the increase of the viscosity.

Abstract: In recent years, it has been proposed that multi-scale numerical analyses can be applied to structural design to reduce experimental efforts. Although many multi-scale analyses have been mainly applied to mechanical dynamics, they do not approach the subject from a thermal perspective, which is a very important phenomenon for structural design. With this consideration, in this paper we dealt with the formulation and programming of the unsteady-state heat transfer problem by a mesh superposition method, which is spotlighted in the stress analysis field. The numerical results of the proposed method have good agreement with the conventional finite element method. It has also been verified that the developed program has good accuracy and that the proposed method is useful in the design of engineering products.

Abstract: This study investigated a method for estimating hardness distribution in welds, considering the effect of phase transformation and weld thermal cycles. Hardness distribution in welds was estimated from fractions and hardness of each microstructure by using rule of mixture. Finite element heat conduction analysis was performed to calculate weld thermal cycles. Microstructures formed corresponding to the thermal cycle were also calculated based on the continuous cooling transformation (CCT) diagram. The method mentioned above was applied to welds of Ultra-Narrow Gap welding process, which was developed for welding of ultrafine-grained steels. The calculated thermal cycles in the welds corresponded with measured results. Moreover, the estimated hardness distribution in the welds, which were estimated by using calculated thermal cycles and the phase fraction of each microstructure, was also in good agreement with measured values.

Abstract: We propose a novel bonding process using Ag metallo-organic nanoparticles, of which the average particle size is around 11 nm. In this paper, Al, Ti, Ni, Cu, Ag and Au disc joints were made using the Ag metallo-organic nanoparticles in order to investigate the bondability of the various metals. These joints are evaluated based on measurement of the shear strength, and the observation of the fracture surfaces and the cross-sectional microstructures. The shear strength of the various metal joints increased in the following order: Al, Ti, Ni, Cu, Ag and Au. This corresponds to the order of the standard-free energy value of the oxide formation for each metal. In particular, while the strengths of the Cu, Ag and Au joints, in which the oxides can be reduced by carbon, were the same level, those of the Al and Ti joints, of which the oxides were more stable than carbon oxides, were extremely low. This result suggests that the carbon atoms or organic elements generated by the decomposition of the organic shell of the Ag metallo-organic nanoparticles may play a role in deoxidizing the oxide film on the metal surface. This can promote chemical bonding between the Ag nanoparticles and metals at low temperatures.

Abstract: Potential dependence of the friction force between an atomically-flat terrace of Au(100) single crystal and a tip attached to a silicon nitride cantilever of electrochemical atomic force microscope (EC-AFM) have been investigated qualitatively in 0.05 M H2SO4 aqueous solution. It is found that the friction force gains when the potential increases in the potential range between −400 mV and 400 mV vs Hg/Hg2SO4 electrode.