Papers by Author: Akiyoshi Chayahara

Abstract: Diamond is a hopeful candidate for power switching device which can operate at high temperature as a “Cooling system free” device, yet at a high current. Recently we have developed a 3D diamond CVD growth method coupled with a sophisticated “direct wafer fabrication technique” to fabricate diamond wafer without slicing. Currently, half inch size single crystal diamond substrates are available for R&D of diamond device. Using this technique, we have increased the device fabrication size from 3x3mm2 to half inch wafer. In this paper, we present the results of measurements on the first device fabricated on a half inch size CVD substrate. We have carried out the first device characteristics mapping for diamond, and have observed the influence of substrate characteristics on the SBD characteristics.

Abstract: Recent developments in producing large single crystal CVD diamond plates are reviewed. The developments consist of synthesis of large single crystal diamond and production of single crystal diamond plates from the bulk diamond by the lift-off process. Combining these developments, half-inch single crystal CVD diamond plates have been successfully produced.

Abstract: Multiple P or S hot ion implantation to diamond substrates was performed at 800°C. Optical absorption spectra indicated that instantaneous annealing during hot ion implantation occurs. Temperature dependence of resistance demonstrated that a P as-implanted sample using a homoepitaxial diamond film substrate emerges a weak doping effect. Also on S implantation, a presence of a weak doping effect was observed in an as-implanted sample, but it was suggested that the dopant is not S itself but S and defect complex. However, post-implantation annealing resulted in high resistance of the samples and missing of such weak doping effects.