Papers by Author: Alain Portavoce

Abstract: A method is presented to measure lattice and grain boundary diffusion coefficients using secondary ion mass spectroscopy and 2-dimensional diffusion simulations. SIMS is used to measure concentration profiles of implanted species before and after annealing. The as-implanted concentration profile is used as the initial condition for 2-dimensional diffusion simulations using the finite element method. The geometry of the simulation is based on the microstructure of the sample observed by transmission electron microscopy. Both lattice and grain boundary diffusion are simulated. The final 2-dimensional concentration distribution is projected on the depth axis to obtain a simulated depth profile. The diffusion coefficients are adjusted to fit the profiles measured after annealing. We find that this method allows to determine simultaneously and independently the lattice and grain boundary diffusion coefficients from the same profiles. This method is used to measure the diffusion coefficients of As in polycrystalline Ni2Si thin films. The simulations are found to fit the measured profiles with accuracy. The coefficients are measured between 550 and 700°C. An activation energy ratio Qgb/Qv is found greater than one. This result is corroborated by existing data in silicides and is compared to results in other materials for discussion.

Abstract: Diffusion controlled processes play a crucial role in the degradation of technical materials. At low temperatures the most significant of them is the diffusion along grain boundaries. In thin film geometry one of the best methods for determining the grain boundary (GB) diffusion coefficient of an impurity element is the Hwang-Balluffi method, in which a surface sensitive technique is used to follow the surface accumulation kinetics. Results of grain boundary diffusion measurements, carried out in our laboratory by this method in three different materials systems (Ag/Pd, Ag/Cu and Au/Ni) are reviewed. In case of Ag diffusion along Pd GBs the surface accumulation was followed by AES method. The data points can be well fitted by an Arrhenius function with an activation energy Q=0.99eV

Abstract: We present an experimental study by Auger electron spectroscopy (AES) and low energy electron diffraction (LEED) of the dissolution of about one monolayer of silicon previously deposited at room temperature on Cu (001). The isochronal dissolution has been recorded in the temperature range [50-320°C] (annealing rate 1.5°C/min). The plateau observed in the kinetics dissolution for temperatures between 95°C and 240°C, reveals the formation of an intermetallic two dimensional superficial phase thermally stable in this range of temperature. On the plateau, LEED patterns show the formation of a (5x3) superstructure. Above 255°C, we observe a very fast dissolution of the surface alloy characteristic of a first-order surface transition. Isothermal dissolutions kinetics have been recorded above and under the surface transition temperature (250°C and 270°C). From these measurements, we have evaluated bulk diffusion coefficients of Si in Cu assuming a local equilibrium. The diffusion coefficients measured within this hypothesis at 250°C and 270°C are respectively higher and lower than those extrapolated from high temperature measurements for Ge in Cu.

Abstract: Depending on the thermodynamic, structural and diffusion properties of the system, a thin deposit dissolves into a substrate by different mechanisms. In this communication these different behaviours, investigated by surface analytical techniques (AES, XPS, STM, UPS, etc) [ - ], are reviewed. The experiments were also supported by computer simulations. The obtained results are compared and it is summarized how different parameters influence the dissolution of a thin film in a substrate. Furthermore, it is show that i) the volume dissolution kinetics is different on the atomic-/nano-scale than on the microscopic scale due to the diffusion asymmetry ii) the volume and GB diffusion in one measurement can be separated and iii) pure (C-kinetic) GB diffusivities can be determined from thin film kinetics measurements performed under adequate conditions.

Abstract: Atom redistribution during crystallization of a B and P co-doped amorphous Si layer produced by Si and P chemical vapor co-deposition and B implantation has been investigated. The crystallization of the entire layer is quasi-instantaneous for annealing temperature greater than 650 °C. The crystallization rate is well reproduced by the Avrami-Johnson-Mehl-Kolmogorov model of transformation. The Avrami n is found equal to 4, which is corresponding to 3D bulk crystallization. Crystallization promotes a non-Fickian redistribution of B atoms, allowing for an abrupt interface between B-doped and B-undoped regions. After crystallization, B diffuses in the polycrystalline Si layer for concentrations lower than 1.5  1020 at cm3 via the type B kinetic regime. Crystallization has no significant (or detectable) influence on the P profile. For temperatures higher than 750 °C, P diffuses in the poly-Si layer towards the region of highest B concentration via the type B kinetic regime, leading to P uphill diffusion. This phenomenon can be simulated considering chemical interactions between B and P atoms in both grains and grain boundaries.

Abstract: We have investigated the redistribution of B during the crystallization of an amorphous Si layer homogeneously doped with P. The redistribution of B only occurs for concentrations lower than 2 × 1020 at cm−3. Crystallization leads to a non “Fickian” redistribution, allowing an abrupt interface between the regions doped and undoped with B. Once the crystallization is ended, B diffuses through the layer in the type B regime with a coefficient which is in agreement with the literature data for diffusion in polycrystalline Si. Although the P distribution is homogeneous in the entire layer, for a temperature as high as 755 °C, P diffuses towards the region the most concentrated in B. The B and P interactions are interpreted as chemical interactions.

Abstract: We have investigated the lattice diffusion of B and Sb by means of molecular beam epitaxy in Si1−xGex (x < 0.2) layers grown on Si(001) substrate. Using Si1−xGex relaxed buffers we were able to differentiate the chemical effect (change in the Ge composition) as opposite to the biaxial stress effect (due to the epitaxy on Si) on dopant diffusion. B diffusion follows a behavior opposite to Sb diffusion versus Ge composition and biaxial stress. These results are explained in view of the difference of diffusion mechanism between B (interstitials) and Sb (vacancies). We also show that dopant diffusion follows contrasting behaviors under biaxial pressure and hydrostatic pressure, and that the activation volume of dopant diffusion is of opposite sign for biaxial pressure and for hydrostatic pressure. This is explained using a formalism based on the extra work done by the system for diffusion under pressure, concluding that for biaxial stress the activation volume depends mainly on the relaxation volume linked to the defect formation.