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Articles by author: C.G. Lee

• A Limited Condition for Bifurcate or Trifurcate Kirkendall Planes in Multiple Phase Diffusion Couples
  Published in: Diffusion in Solids and Liquids V (p1487)
• Effects of Fourth Alloying Additives on Interfacial Microstructure of Sn-Ag-Cu Lead-Free Soldered Joints
  Published in: Eco-Materials Processing & Design IV (p7)
• Numerical Analysis for the Behavior of Multiple Markers in Multiple Phase Diffusion Couples
  Published in: Diffusion in Solids and Liquids IV (p394)
• Oxidation Behavior of TiAl₃ Formed in Ti/Al Diffusion Couple and Reaction Diffusion in Ti/TiAl₃ Multi-Phase Diffusion Couple
  Published in: Diffusion in Solids and Liquids (p340)
• Reaction Diffusion in Pb Free Solder-Cu System
  Published in: Diffusion in Solids and Liquids V (p796)