Papers by Author: Chun Yan Yao

Abstract: A novel technology is studied in this paper to make photosensitive resin grinding wheel based on layered manufacturing technology. The bond strength among resin layers is analyzed. An effective measure is proposed to improve the bond strength among resin layers of the grinding wheel. We add magnetic abrasive particles into the liquid resin to get rough surface and increase contact area by action of magnetic force. Some experiments are curried out for testing shear strength of resin with magnetic abrasive under different conditions. Results show that this method had a significant effect in improving the bond strength among layers of new grinding wheel.

Abstract: Fixed-abrasive diamond wire saw is widely used for slicing semiconductor materials. In this paper, a novel manufacturing method is studied by using polyethylene wire to replace the traditional metallic core wire. A new coating device of ultraviolet-curing for rapidly making diamond wire saw is developed. In terms of tensile strength experiments’ results, a high strength polyethylene multi-strand wire is finally selected as the core wire of the fixed-abrasive wire saws. Experimental results show that the high tensile strength of polyethylene multi-strand wire can satisfy the technical requirements of fixed-abrasive wire saws.

Abstract: Slicing the wafers with diamond wire saw is recently paid much attention. This study proposes a novel method for developing a kind of diamond wire saws with ultraviolet curing resin and spraying technique. The process of wire saw manufacturing and the selection of optimal parameters are introduced. The experiments of the slicing marble are carried out using different diamond wire saws. The effects of wire saw running speed, work-piece in-feed speed, work-piece rotation frequency on the material removal rate, and surface roughness were investigated. Result shows that new method for development of diamond wire saw is feasible.