Papers by Author: Darren M. Hansen

Abstract: Studies of threading dislocations with Burgers vector of c+a have been carried out using synchrotron white beam X-ray topography. The nucleation and propagation of pairs of opposite sign threading c+a dislocations is observed. Overgrowth of inclusions by growth steps leads to lattice closure failure and the stresses associated with this can be relaxed by the nucleation of opposite sign pairs of dislocations with Burgers vector c+a. Once these dislocations are nucleated they propagate along the c-axis growth direction, or can be deflected onto the basal plane by overgrowth of macrosteps. For the c+a dislocations, partial deflection can occasionally occur, e.g. the a-component deflects onto basal plane while the c-component continuously propagates along the growth direction. One factor controlling the details of these deflection processes is suggested to be related to the ratio between the height of the overgrowing macrostep and that of the surface spiral hillock associated with the threading growth dislocations with c-component of Burgers vector.

Abstract: In this paper, we report on the synchrotron white beam topographic (SWBXT) observation of “hopping” Frank-Read sources in 4H-SiC. A detailed mechanism for this process is presented which involves threading edge dislocations experiencing a double deflection process involving overgrowth by a macrostep (MP) followed by impingement of that macrostep against a step moving in the opposite direction. These processes enable the single-ended Frank-Read sources created by the pinning of the deflected basal plane dislocation segments at the less mobile threading edge dislocation segments to “hop” from one slip plane to other parallel slip planes. We also report on the nucleation of 1/3< >{ } prismatic dislocation half-loops at the hollow cores of micropipes and their glide under thermal shear stress.

Abstract: A review is presented of Synchrotron White Beam X-ray Topography (SWBXT) studies of stacking faults observed in PVT-Grown 4H-SiC crystals. A detailed analysis of various interesting phenomena were performed and one such observation is the deflection of threading dislocations with Burgers vector c/c+a onto the basal plane and associated stacking faults. Based on the model involving macrostep overgrowth of surface outcrops of threading dislocations, SWBXT image contrast studies of these stacking faults on different reflections and comparison with calculated phase shits for postulated fault vectors, has revealed faults to be of basically four types: (a) Frank faults; (b) Shockley faults; (c) Combined Shockley + Frank faults with fault vector s+c/2; (d) Combined Shockley + Frank faults with fault vector s+c/4.

Abstract: Synchrotron White Beam X-ray Topography (SWBXT) imaging of wafers cut parallel to the growth axis from 4H-SiC boules grown using Physical Vapor Transport has enabled visualization of the evolution of the defect microstructure. Here we present observations of the propagation and post-growth mutual interaction of threading growth dislocations with c-component of Burgers vector. Detailed contrast extinction studies reveal the presence of two types of such dislocations: pure c-axis screw dislocations and those with Burgers Vector n₁c+n₂a, where n₁ is equal to 1 and n₂ is equal to 1 or 2. In addition, observations of dislocation propagation show that some of the threading dislocations with c-component of Burgers adopt a curved, slightly helical morphology which can drive the dislocations from adjacent nucleation sites together enabling them to respond to the inter-dislocation forces and react. Since all of the dislocations exhibiting such helical configurations have significant screw component, and in view of the fact that such dislocations are typically not observed to glide, it is believed that such morphologies result in large part from the interaction of a non-equilibrium concentration of vacancies with the originally approximately straight dislocation cores during post-growth cooling. Such interactions can lead to complete or partial Burgers vector annihilation. Among the reactions observed are: (a) the reaction between opposite-sign threading screw dislocations with Burgers vectors c and –c wherein some segments annihilate leaving others in the form of trails of stranded loops comprising closed dislocation dipoles; (b) the reaction between threading dislocations with Burgers vectors of -c+a and c+a wherein the opposite c-components annihilate leaving behind the two a-components; (c) the similar reaction between threading dislocations with Burgers vectors of -c and c+a leaving behind the a-component.

Abstract: Synchrotron White Beam X-ray Topography studies are presented of dislocation behavior and interactions in a new generation of seventy-six millimeter diameter, 4H-SiC wafers grown using Physical Vapor Transport under specially designed low stress conditions. Such low stress growth conditions have enabled reductions of dislocation density by two or three orders of magnitude compared to the lowest previously reported levels [1]. In this paper, detailed topography analysis will be presented of the deflection of threading dislocations with Burgers vectors of c and c+a onto the basal plane leading to reductions of the density of such dislocations down to levels of ~187 cm-2. The deflection of the latter type of dislocations produces complex faulted defect configurations and models for their creation are presented and discussed.

Abstract: Synchrotron White Beam X-ray Topography (SWBXT) studies are presented of basal plane dislocation (BPD) configurations and behavior in a new generation of 100mm diameter, 4H-SiC wafers with extremely low BPD densities (3-4 x 102 cm-2). The conversion of non-screw oriented, glissile BPDs into sessile threading edge dislocations (TEDs) is observed to provide pinning points for the operation of single ended Frank-Read sources. In some regions, once converted TEDs are observed to re-convert back into BPDs in a repetitive process which provides multiple BPD pinning points.

Abstract: Low temperature infrared photoluminescence (PL) performed on a large set of bulk SiC substrates has revealed distinct series of lines between 0.8 and 1.5 eV for samples with nitrogen levels between ~ 1016 and 1017 cm-3. Semi-insulating and intentionally N-doped wafers grown by PVT and HTCVD were investigated. Two groups of PL lines clustered near 1.0 and 1.35 eV, respectively, were observed in n-type 4H-SiC. Not surprisingly, a multiplicity of features at slightly different energy positions was found for this emission from the 6H- and 15R-SiC polytypes. Both sets of lines were not observed for substrates with N doping concentrations greater than 3x1017cm-3. Thus, it appears this IR emission can serve as optical “fingerprints” of bulk n-type substrate with moderate levels of N impurities. Models for the possible origins of these lines will also be discussed.

Abstract: Excess carrier lifetimes in 4H SiC epitaxial wafers were characterized by microwave photoconductive decay (o/PCD). The measured decay compromised of surface and bulk recombination curves have fast and slow components. Measured lifetimes are not changed with various surface passivation techniques. High resolution lifetime maps show good correlation with stress birefringence images and lower lifetime around extended material defects like grainboundaries, defect clusters, edge defects and polytype switching bands. Chlorosilane based CVD epiwafers show higher bulk lifetime values than standard silane based CVD materials due to less bulk lifetime defect density.

Abstract: Presented is the use of a commercial optical scanner for the mapping of doping density ( ) D N of SiC substrates and as a local probe for D N in different regions. This method provides a fast and cost effective method for determining D N homogeneity, examining local electrical characteristics, and recognizing defect sites including areas of different polytypes or polycrystallinity. Micro-Raman spectroscopy was used to calibrate the transmission intensity with D N . It is shown that features presented in the calculated D N maps strongly correlate to those observed in Lehighton resistivity maps.

Abstract: A detailed understanding of the incorporation of N2 gas during PVT growth of SiC is required to achieve high performance, low resistivity n+ SiC substrates necessary for power device applications. In this report, nitrogen incorporation is investigated for growth of 4H SiC crystals from 2” to 3” diameter in conditions ranging from unintentionally doped to low resistivity (0.015
- cm). For a wafer in a particular boule a resistivity uniformity of ± 5% is typical although the uniformity decreases when the wafer orientation is cut off axis from the bulk growth direction. Within a boule growth, the nitrogen incorporation is found to be a function of growth time. As growth continues, the resistivity of wafers cut further from the seed increases. A typical 3” on axis sliced wafer has a within wafer resistivity uniformity of 5% compared with an average seed to tail variation of 10%. Due to the axial resistivity gradient the within wafer resistivity uniformity of off axis sliced wafers is 8%. These axial and radial gradients are thought to be a function of the changing C/Si ratio during growth. Nitrogen incorporation as a function of PVT geometry, N2 partial pressure, and growth temperature are investigated and discussed. In particular, nitrogen incorporation is found to depend on the crucible size and nitrogen partial pressure, but is not strongly dependent on the absolute growth temperature, for growth temperature ranging over 150°C. Modeling of PVT growth shows the axial resistivity gradient can be linked with a change in the C/Si ratio versus time. Trends and N2 gas incorporation behavior will be discussed using resistivity mapping, SIMS, and Hall effect data.