Papers by Author: Dominique Mangelinck

Abstract: A method is presented to measure lattice and grain boundary diffusion coefficients using secondary ion mass spectroscopy and 2-dimensional diffusion simulations. SIMS is used to measure concentration profiles of implanted species before and after annealing. The as-implanted concentration profile is used as the initial condition for 2-dimensional diffusion simulations using the finite element method. The geometry of the simulation is based on the microstructure of the sample observed by transmission electron microscopy. Both lattice and grain boundary diffusion are simulated. The final 2-dimensional concentration distribution is projected on the depth axis to obtain a simulated depth profile. The diffusion coefficients are adjusted to fit the profiles measured after annealing. We find that this method allows to determine simultaneously and independently the lattice and grain boundary diffusion coefficients from the same profiles. This method is used to measure the diffusion coefficients of As in polycrystalline Ni2Si thin films. The simulations are found to fit the measured profiles with accuracy. The coefficients are measured between 550 and 700°C. An activation energy ratio Qgb/Qv is found greater than one. This result is corroborated by existing data in silicides and is compared to results in other materials for discussion.

Abstract: Atom redistribution during crystallization of a B and P co-doped amorphous Si layer produced by Si and P chemical vapor co-deposition and B implantation has been investigated. The crystallization of the entire layer is quasi-instantaneous for annealing temperature greater than 650 °C. The crystallization rate is well reproduced by the Avrami-Johnson-Mehl-Kolmogorov model of transformation. The Avrami n is found equal to 4, which is corresponding to 3D bulk crystallization. Crystallization promotes a non-Fickian redistribution of B atoms, allowing for an abrupt interface between B-doped and B-undoped regions. After crystallization, B diffuses in the polycrystalline Si layer for concentrations lower than 1.5  1020 at cm3 via the type B kinetic regime. Crystallization has no significant (or detectable) influence on the P profile. For temperatures higher than 750 °C, P diffuses in the poly-Si layer towards the region of highest B concentration via the type B kinetic regime, leading to P uphill diffusion. This phenomenon can be simulated considering chemical interactions between B and P atoms in both grains and grain boundaries.

Abstract: We have investigated the redistribution of B during the crystallization of an amorphous Si layer homogeneously doped with P. The redistribution of B only occurs for concentrations lower than 2 × 1020 at cm−3. Crystallization leads to a non “Fickian” redistribution, allowing an abrupt interface between the regions doped and undoped with B. Once the crystallization is ended, B diffuses through the layer in the type B regime with a coefficient which is in agreement with the literature data for diffusion in polycrystalline Si. Although the P distribution is homogeneous in the entire layer, for a temperature as high as 755 °C, P diffuses towards the region the most concentrated in B. The B and P interactions are interpreted as chemical interactions.

Abstract: The effect of Pt and Ge on the stability of NiSi films has been examined. The addition of a small amount of Pt (5 at%) in the Ni film increases the disilicide nucleation temperature to 900oC leading to a better stability of NiSi at high temperatures. For Ni films on Si1-xGex with x=0.29 and 0.58, no NiSi2 was found after annealing at 850°C. The increase in thermal stability of NiSi has been explained in terms of nucleation concept. Calculated ternary phase diagrams allow to understand the effect of the third element (Pt or Ge) on the driving force for nucleation. The redistribution of this element can also be explained with the ternary phase diagrams.