Papers by Author: Glenn W. Gale

Abstract: The semiconductor industry is undergoing a transition driven by end use markets. In recent years, mobile devices have been the leading generator of growth. Now the connection of various products and machines to the internet is generating new and extensive demands for memory (storage of the data), logic (intelligent processing of the data including machine learning), and sensing (e.g., image sensors generating visual data). Thus the versatile planar MOS transistor based semiconductor technology has diverged into various specialized and complex branches, with each technology type using unique approaches to address scaling challenges. These lead to specific requirements for semiconductor wafer surface preparation. This paper will review the high level industry trends and how they affect surface preparation specifically.

Abstract: As the dimensions of the structures of integrated circuits shrink, the influence of particles on device yield becomes increasingly important. According to the cleaning requirements of the International Technology Roadmap for Semiconductors (ITRS) in 2007, particles of 32 nm and larger are believed to be detrimental to devices and thus have to be removed. To remove nano-particles with minimal substrate loss and no damage requires very dilute chemistries and sufficiently gentle physical forces in a cleaning process. In this work the performance of an aerosol spray based cleaning technique is evaluated with regard to the removal efficiency of nano-particles as well as substrate loss and structural damage.