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Papers by Author: H. Kraus

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Wafer Backside Cleaning Strategies for High-k/Metal Gate Processing

Authors: Rita Vos, Els Kesters, Sylvain Garaud, R. De Waele, Karine Kenis, Marcel Lux, H. Kraus, James Snow, Denis Shamiryan, Gabriela Catana, W. Deweerd, T. Schram, S. DeGendt, Paul W. Mertens

Abstract: In this work the removal of different metallic and particulate contaminants relevant for high-k/metal gate processing is studied. Best cleaning efficiency of both silicon and nitride substrates is achieved using a HF/HNO3-based cleaning resulting in a particle removal efficiency higher than 90% and metal removal down to 1010 at/cm2.

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Selective Wet Removal of Hf-Based Layers and Post-Dry Etch Residues in High-k and Metal Gate Stacks

Authors: Martine Claes, Vasile Paraschiv, S. Beckx, M. Demand, W. Deweerd, Sylvain Garaud, H. Kraus, Rita Vos, James Snow, Werner Boullart, Stefan De Gendt