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Articles by author: Hui Yuan

• Edge Grinding of Ceramic Tile by Diamond Cup Wheels
  Published in: Advances in Grinding and Abrasive Technology XIII (p85)
• Effects of Conditioning Parameters on Pad Performances
  Published in: Advances in Machining & Manufacturing Technology IX (p293)
• Influence of Polishing Parameters on Chemical Mechanical Polishing Processes of LiTaO₃ Wafer
  Published in: Advances in Machining & Manufacturing Technology VIII (p561)
• Microstructure of Ni-Al-Diamond Composite Fabricated by Self-Propagating High Temperature Synthesis
  Published in: Advances in Abrasive Technology VIII (p531)
• Study on Chemical Mechanical Polishing Mechanism of LiTaO₃ Wafer
  Published in: Advances in Grinding and Abrasive Technology XIII (p310)
• Wear Characteristics of ID Saw Blade in Silicon Ingot Slicing Process
  Published in: Advances in Materials Manufacturing Science and Technology II (p157)