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Articles by author: Ja Myeong Koo

• A Comparative Evaluation of Friction-Welded and Brazed Ti and AISI 321 Stainless Steel Joints
  Published in: Advanced Welding and Micro Joining / Packaging for the 21st Century (p423)
• Interfacial Reaction and Bump Shear Property of Electroplated Sn-37Pb Solder Bump with Ni under Bump Metallization during Multiple Reflows
  Published in: THERMEC 2006 Supplement (p181)
• Mechanical and Electrical Properties of Sn-3.5Ag Solder/Cu BGA Packages during Multiple Reflows
  Published in: Advances in Fracture and Strength (p801)
• Mechanical Properties of Copper Hollow Sphere Manufactured by Sintering Process
  Published in: Eco-Materials Processing & Design VII (p730)
• Reliability Evaluation of Underfill Encapsulated Pb-Free Flip Chip Package under Thermal Shock Test
  Published in: Eco-Materials Processing and Design VIII (p621)
• Reliability of Electroplated Sn-37Pb Solder Bumps with Different Under Bump Metallizations (UBMs) during High Temperature Storage Test
  Published in: Advances in Nanomaterials and Processing (p5)