Papers by Author: Jia Lu Tang

Abstract: 3-layer anodic bonding is one of the key technologies in the manufacture of complicated structure. The microcosmic process and current model of the 3-layer anodic bonding was investigated, and a new technology scheme with better bonding effect was developed. Using the experiment device, quantities of bonding current curves were obtained by the data collecting system. Under tensile testing device, intensity of the bonding was tested. By analysis of the data collected, the 3-layer bonding model was inspected, and the efficacy of the new technology scheme was proved.

Abstract: In this paper, we make a detail analysis of some factors, which affects the electrostatic bonding process. According to the electrical properties of glass, combined with the principle of electrostatic bonding, we analysed the relationship of critical bonding time, voltage and temperature as well as the factors which affect electrostatic bonding. Then we come up with the mathematical model of the intensity and temperature of electrostatic bonding. In accordance with the above-mentioned formula and the experimental data, we can get the following conclusions: the intensity of electrostatic bonding is much greater between 280°C to 370°C; the best temperature for this bonding is about 350°C; however, when the temperature is below 280°C,the intensity of electrostatic bonding is lower due to the great impact of particles under low temperature; but when the temperature is higher than 370°C,the mismatch of coefficient of thermal expansion of silicon and glass gets larger, then as a result, the intensity of this bonding has a significant decrease with the increasing of temperature.

Abstract: To simulate the whole process of anodic bonding accurately, this paper makes the research on the current of anodic bonding with area and point cathode respectively. Based on the known models of anodic bonding, novel current formulas are deduced for anodic bonding with area cathode by means of the relation between glass resistivity and temperature. After calibrated by statistics of experimental data, the formulas quantitatively describe the relation between bonding current with time, as well as bonding voltage and bonding temperature. Further, using spreading model of anodic bonding, an approach to dealing with the problem of point cathode current is presented. The experiments prove that the current formulas from the approach are able to indicate the law of point cathode current.