Papers by Author: Ju Young Kim

Abstract: Flow properties and stress state are indispensable factors for safety assessment of structural materials in operation, which were evaluated using instrumented indentation tests (IITs). Flow properties were obtained by defining representative stress and strain, and IIT results for 10 steel materials were discussed by comparing with those from uniaxial tensile tests. The indentation load-depth curve is significantly affected by the presence of residual stress, and the stress-induced load change was converted to a quantitative stress value. The stress state of a friction stir-welded joint of API X80 steel was evaluated and compared with that measured by energy-dispersive X-ray diffraction.

Abstract: We tried to apply the nanoindentation technique to yield strength characterization by modifying a previous research. Although the yield strength determining technique developed by Kramer et al. has been successfully demonstrated for large scale indentations on bulky metals, its applicability is still doubtful to nanoscale indentations on thin films with severe roughness, anisotropy, and interfacial constraint. In order to overcome these problems, we combined the nanoindentation technique with a three-dimensional indent visualization technique in this study. Nanoindentation tests were performed for Au and TiN thin films and their corresponding indents were scanned by using an atomic force microscope. From the three-dimensional pile-up morphology, a circular pile-up boundary was measured and input into the yield strength formulation as an effective yielded zone radius. The yield strengths calculated were directly compared with those from the microtensile test.

Abstract: Amorphous silicon carbide (a-SiC) films were deposited using molecular dynamics simulations employing the Tersoff potential. The structure and intrinsic stress of a-SiC films changed dramatically with changes in such principal deposition process parameters as substrate temperature and incident energy. Changes in structure and intrinsic stress with deposition process parameters were analyzed.