Papers by Author: Mark J. Loboda

Abstract: Synchrotron white beam x-ray topography (SWBXT), synchrotron monochromatic beam x-ray topography (SMBXT), and high resolution transmission electron microscopy (HRTEM) studies have been carried out on stacking faults in PVT grown 4H-SiC crystal. Their fault vectors were determined by SWBXT to be 1/3<-1100>, 1/2<0001>, 1/6<-2203>, 1/12<4-403>, 1/12<-4403>. HRTEM studies reveal their similarity in stacking sequences as limited numbers of bilayers of 6H polytype structure. Simulation results of the two partial dislocations associated with the stacking faults in SMBXT images reveal the opposite sign nature of their Burgers vectors. A mechanism for stacking fault formation via 2D nucleation is postulated.

Abstract: Dislocation behavior during homo-epitaxy of 4H-SiC on offcut substrates by Chemical Vapor Deposition (CVD) has been studied using Synchrotron X-ray Topography and KOH etching. Studies carried out before and after epilayer growth have revealed that, in some cases, short, edge oriented segments of basal plane dislocation (BPD) inside the substrate can be drawn towards the interface producing screw oriented segments intersecting the growth surface. In other cases, BPD half-loops attached to the substrate surface are forced to glide into the epilayer producing similar screw oriented surface intersections. It is shown that the initial motion of the short edge oriented BPD segments that are drawn from the substrate into the epilayer is caused by thermal stress resulting from radial temperature gradients experienced by the wafer whilst in the epi-chamber. This same stress also causes the initial glide of the surface half-loop into the epilayer and through the advancing epilayer surface. These mobile BPD segments provide screw oriented segments that pierce the advancing epilayer surface that initially replicate as the crystal grows. Once critical thickness is reached, according to the Mathews-Blakeslee model, these screw segments glide sideways under the action of the mismatch stress leaving IDs and HLAs in their wake.

Abstract: Studies of threading dislocations with Burgers vector of c+a have been carried out using synchrotron white beam X-ray topography. The nucleation and propagation of pairs of opposite sign threading c+a dislocations is observed. Overgrowth of inclusions by growth steps leads to lattice closure failure and the stresses associated with this can be relaxed by the nucleation of opposite sign pairs of dislocations with Burgers vector c+a. Once these dislocations are nucleated they propagate along the c-axis growth direction, or can be deflected onto the basal plane by overgrowth of macrosteps. For the c+a dislocations, partial deflection can occasionally occur, e.g. the a-component deflects onto basal plane while the c-component continuously propagates along the growth direction. One factor controlling the details of these deflection processes is suggested to be related to the ratio between the height of the overgrowing macrostep and that of the surface spiral hillock associated with the threading growth dislocations with c-component of Burgers vector.

Abstract: In this paper, we report on the synchrotron white beam topographic (SWBXT) observation of “hopping” Frank-Read sources in 4H-SiC. A detailed mechanism for this process is presented which involves threading edge dislocations experiencing a double deflection process involving overgrowth by a macrostep (MP) followed by impingement of that macrostep against a step moving in the opposite direction. These processes enable the single-ended Frank-Read sources created by the pinning of the deflected basal plane dislocation segments at the less mobile threading edge dislocation segments to “hop” from one slip plane to other parallel slip planes. We also report on the nucleation of 1/3< >{ } prismatic dislocation half-loops at the hollow cores of micropipes and their glide under thermal shear stress.

Abstract: This paper reports the progress of the thick epitaxy development at Dow Corning. Epiwafers with thickness of 50 – 100 m have been grown on 4° off-axis 76mm 4H SiC substrates. Smooth surface with RMS roughness below 1nm and defect density down to 2 cm-2 are achieved for 80 - 100 m thick epiwafers. Long carrier lifetime of 2 – 4 s are routinely obtained, and low BPD density in the range of 50 down to below 10 cm-2 is confirmed. High voltage JBS diodes have been successfully fabricated on these wafers with thick epitaxial layers.

Abstract: A review is presented of Synchrotron White Beam X-ray Topography (SWBXT) studies of stacking faults observed in PVT-Grown 4H-SiC crystals. A detailed analysis of various interesting phenomena were performed and one such observation is the deflection of threading dislocations with Burgers vector c/c+a onto the basal plane and associated stacking faults. Based on the model involving macrostep overgrowth of surface outcrops of threading dislocations, SWBXT image contrast studies of these stacking faults on different reflections and comparison with calculated phase shits for postulated fault vectors, has revealed faults to be of basically four types: (a) Frank faults; (b) Shockley faults; (c) Combined Shockley + Frank faults with fault vector s+c/2; (d) Combined Shockley + Frank faults with fault vector s+c/4.

Abstract: Synchrotron White Beam X-ray Topography (SWBXT) imaging of wafers cut parallel to the growth axis from 4H-SiC boules grown using Physical Vapor Transport has enabled visualization of the evolution of the defect microstructure. Here we present observations of the propagation and post-growth mutual interaction of threading growth dislocations with c-component of Burgers vector. Detailed contrast extinction studies reveal the presence of two types of such dislocations: pure c-axis screw dislocations and those with Burgers Vector n₁c+n₂a, where n₁ is equal to 1 and n₂ is equal to 1 or 2. In addition, observations of dislocation propagation show that some of the threading dislocations with c-component of Burgers adopt a curved, slightly helical morphology which can drive the dislocations from adjacent nucleation sites together enabling them to respond to the inter-dislocation forces and react. Since all of the dislocations exhibiting such helical configurations have significant screw component, and in view of the fact that such dislocations are typically not observed to glide, it is believed that such morphologies result in large part from the interaction of a non-equilibrium concentration of vacancies with the originally approximately straight dislocation cores during post-growth cooling. Such interactions can lead to complete or partial Burgers vector annihilation. Among the reactions observed are: (a) the reaction between opposite-sign threading screw dislocations with Burgers vectors c and –c wherein some segments annihilate leaving others in the form of trails of stranded loops comprising closed dislocation dipoles; (b) the reaction between threading dislocations with Burgers vectors of -c+a and c+a wherein the opposite c-components annihilate leaving behind the two a-components; (c) the similar reaction between threading dislocations with Burgers vectors of -c and c+a leaving behind the a-component.

Abstract: Synchrotron White Beam X-ray Topography studies are presented of dislocation behavior and interactions in a new generation of seventy-six millimeter diameter, 4H-SiC wafers grown using Physical Vapor Transport under specially designed low stress conditions. Such low stress growth conditions have enabled reductions of dislocation density by two or three orders of magnitude compared to the lowest previously reported levels [1]. In this paper, detailed topography analysis will be presented of the deflection of threading dislocations with Burgers vectors of c and c+a onto the basal plane leading to reductions of the density of such dislocations down to levels of ~187 cm-2. The deflection of the latter type of dislocations produces complex faulted defect configurations and models for their creation are presented and discussed.

Abstract: Improvements in the quality and consistency of 4H-SiC epitaxy wafers are now starting to enable growth of commercial SiC power device applications in areas such as inverters for photo-voltaic systems and power supplies. Recent work has achieved very low epitaxy surface roughness and very low BPD (Basal plane dislocation) in the on 4 degree off-axis substrates. In this paper, we report characterization of the very low BPD epitaxy wafers and a newly observed triangular defect.

Abstract: Correlation between carrier lifetime and forward voltage drop in 4H-SiC PiN diodes has been investigated. PiN diodes from the drift layer of 20 m shows breakdown voltage of 3.3 kV and forward voltage drop as low as 3.13 V at 100A/cm2. Variation of calculated forward voltage drop ( ) from measured carrier lifetimes is very comparable to measured of fully processed PiN diodes. Measured carrier lifetime and of PiN diodes also show good spatial correlation. Wafer level lifetime mapping can be employed to assess and predict of PiN diodes.