Papers by Author: Martin Kittler

Abstract: The heteroepitaxial growth of GeSn and Ge crystals on Si substrates are investigated for Si-based photonic applications. Light Emitting Diodes with emission wavelengths from 2,100 to 1,550 nm could be demonstrated with active intrinsic GeSn light emitting layers between Ge barriers. A clear shift of the direct band gap toward the infrared beyond 2 μm is measured. Emission intensity is increased compared to Ge Light Emitting Diodes. Room temperature lasing from electrically pumped n-type doped Ge edge emitting devices are demonstrated. The edge emitter is formed by cleaving Si-Ge waveguide heterodiodes, providing optical feedback through a Fabry-Pérot resonator. The electroluminescence spectra of the devices showed optical bleaching and intensity gain for wavelengths between 1,660 nm and 1,700 nm.

Abstract: We analyzed multi quantum well light emitting diodes, consisting of ten alternating GeSn/Ge-layers, were grown by molecular beam epitaxy on Si. The Ge barriers were 10 nm thick and the GeSn wells were grown with 7% Sn and thicknesses between 6 and 12 nm. Despite the high threading dislocation density of 10⁹ to 10¹⁰ cm⁻² the electroluminescence spectra measured at 300 and 80 K yield a broad and intensive luminescence band. Deconvolution revealed three major lines produced by the GeSn wells that can be interpreted in terms of quantum confinement. Biaxial compressive strain causes a splitting of light and heavy holes in the GeSn wells. We interpret the three lines to represent two direct lines, formed by transitions with the light and heavy hole band, respectively, andan indirect line.

Abstract: Dislocations are one-dimensional crystal defects. Their dimension characterize the defects as nanostructures (nanowires). Measurements on defined dislocation arrays proved numerous exceptional electronic properties. A model of dislocations as quantum wires is proposed. The formation of the quantum wire is a consequence of the high strain level on the dislocation core modi-fying locally the band structure.

Abstract: We report on 0.93 eV luminescence observed in multicrystalline silicon. The spectral line is close to the well known D3 one, but its properties are different. The new feature shows a remarkable intensity at room temperature, exceeding the intensity of the band to band radiative transition. Moreover, it appears as a single line in the entire temperature range 10-300K, in contrast to the D3, which is usually accompanied by D4. Cathodoluminescence (CL) and electron beam induced current (EBIC) micrographs revealed that the centers causing 0.93 eV emission are irregularly distributed along certain grain boundaries. Electron backscattering diffraction examination showed that the 0.93 eV luminescence appears at grain boundaries characterized by a lattice rotation around a <344> axis. The EBIC contrast at those irregularities indicates strong total recombination. Based on an analysis of the temperature dependence of the CL intensity and the EBIC contrast we obtained an activation energy of about 120 meV.

Abstract: We present an overview on generation of direct gap photo- and electroluminescence in Ge bulk wafers, Ge thin films deposited on Si, and Ge p-i-n diodes prepared on Si substrates. We analyzed the emission in a spectral range from 0.45 eV to 0.95 eV, covering the radiation caused by direct gap transitions, the indirect one, and also the luminescence related to transition on dislocations. The temperature and excitation level strongly influence the intensities of direct and indirect photoluminescence in bulk samples. As it could be expected, high temperature and excitation favour the generation of direct gap luminescence. Intrinsic bulk Ge shows a quadratic dependence of the direct gap luminescence on the excitation and a sub-quadratic one for the indirect. The photoluminescence spectra taken from intrinsic Ge on Si layers show features related to dislocations. There are two spectral regions associated with dislocation recombination. At room temperature one is at around 0.45 eV and the other at 0.72 eV. We found strong direct gap radiation from the Ge p-i-n diodes with intrinsic, highly dislocated active area (dislocation density of about 10⁸-10¹⁰ cm^-2). There is a threshold current density of 8 kA/cm², at which the direct band luminescence becomes a super-quadratic. The dependence of the radiation intensity on the excitation is governed by a power law with exponent of 1.7 before reaching that threshold and 4.5 after exceeding it. Above the threshold the dislocation radiation shows similar dependence on the excitation as the direct band luminescence.

Abstract: The influence of GBs contained in the channel of MOS-FETs - fabricated in thin SOI layers - is demonstrated. The drain current measured at room temperature increases about 50 times for nFETs and about 10 times for pFETs, respectively, as compared to reference devices. The observations might be interpreted as a strong increase of the mobility of charge carriers. Moreover, the observed stepwise changes of the drain current at 5 K may point to Coulomb blockades.

Abstract: The results of investigations of solar grade mc-Si by means of combination of scanning X-ray beam excited optical luminescence microscopy (SXEOL), X-ray beam induced current (XBIC) and X-ray fluorescence (XRF) are presented. It was found, that for relatively clean sample SXEOL and XBIC provide similar information about the recombination activity of defects while for the samples with a high transition metal content there are significant differences in the provided information. The reasons of the revealed XBIC - SXEOL differences are discussed.

Abstract: We present a novel Ge on Si based LED with unstrained i-Ge active region. The device operates at room temperature and emits photons with energy of 0.8 eV. It basically resembles a p-i-n structure formed on a sub-micrometer thin Ge layer. The Ge layer has been grown on Si substrate by utilizing thin virtual buffer, so it becomes stress free but with high threading dislocation density. We show that such forward biased diode generates strong emission, caused by direct band to band transition in Ge. Using an InSb based detector we were able to analyze the emission spectrum in a broad energy range. We show that at low and moderate currents, features belonging to the direct and the indirect band to band electronic transitions are present which are characteristic for Ge. Clearly dominating is the direct transition related peak. Due to the missing stress-related red shift this peak appears close to the desired communication wave length of 1.55 μm. The dependence of radiation intensity on the excitation current follows a power low with exponent of 1.7, indicating that the recombination rate of the competitive nonradiative processes is relatively low. At high excitation currents features appear in the low energetic part of the spectrum. All results presented here are discussed in view of the outcome from measurements on Ge high quality bulk material. The role of the dislocation in the Ge films is discussed.

Abstract: Incorporation of optical components into microelectronic devices will significantly improve their performance. Absence of effective Si-based light emitter hampers such integration. In the present work light emitting Si diodes, fabricated by dopant (boron or phosphorous) implantation and annealing are investigated. Different implantation doses and annealing temperatures were employed. The efficiency of the electroluminescence (EL), obtained from such structures was measured and correlated with the fabrication process parameters. As previously reported, the EL of band-to-band radiative transition in Si is strongly influenced, by the dopant implantation dose, i.e. higher doses usually enhance EL. Our results suggest that the effect is mainly related to the increase of minority carrier lifetime in the substrate. Distinct measurements showed that the higher implantation doses lead longer carrier lifetimes in the samples. The correlation between lifetime and the EL efficiency could be satisfactory explained in the frame of a classical model, considering the carrier-injection dependence of the rates of the three main recombination mechanisms in silicon, i.e. multi-phonon, radiative and Auger recombination. We suppose that the increase in the implantation dose improves minority carrier lifetime due to the gettering of impurity atoms from the substrate material to the highly doped emitter region.

Abstract: The investigation of regular dislocation networks (DN) formed by direct wafer bonding suggests that the D1 and D2 peaks of dislocation-related luminescence (DRL) in silicon is linked to screw dislocations, whereas edge dislocations are responsible for D3 and D4 DRL peaks. Non-radiative recombination activity in DN could be attributed to edge dislocations and could be related to enhanced ability of these dislocations to getter impurity atoms. Obtained relation of DRL intensity with the density of screw dislocations suggests existence of the optimum twist angle for the wafer-bonding geometry for which the DRL intensity has a maximum. The dependence of DRL intensity on the spacing between screw dislocations has the maximum at about 7 nm. Reported radiative and non-radiative recombination properties of DN present substantial interest not only for possible LED applications in all-Si photonics but also for photovoltaics, since DNs represent a model system for grain boundaries controlling carrier lifetime in microcrystalline-Si material.