Authors: Ming Min Huang, Dun Wen Zuo, Wen Zhuang Lu, Feng Xu, Min Wang
Abstract: The performance of Atomic Force Microscope (AFM) is greatly determined by the quality of its probe. Nowadays, probes of diamond tips have become more and more popular than silicon ones, and have been widely used in industries. In this paper, research about the fabricating of nanocrystalline diamond (NCD) coated AFM probe has been done using Hot-Filament Chemical Vapour Deposition (HFCVD) technique. The results showed that NCD films have been grown on the probe. Problems about the growth of NCD on the tips have been discussed. The optimum parameters have also been proposed. This research can provide reference for the further experiments on the fabrication of NCD coated tips.
499
Authors: Hong Jun Wang, Dun Wen Zuo, Hong Miao, Hong Feng Wang, Min Wang
Abstract: The effects of discharge parameters on micro-surface topography in mirror-like surface electrical discharge machining (EDM) process were investigated, and the optimization scheme was obtained. The realization of the process parameters and their effects were analyzed by the Taguchi method. The surface roughness amd 2D micro-surface topography were measured. An L16 (44×23) Taguchi standard orthogonal array was chosen for the design of experiments. The level of importance of the parameters parameters on surface roughness was determined by using analysis of variance (ANOVA). The experimental results confirmed that peak current and open discharge voltage have more influence on the surface roughness on mirror-like surface EDMed workpiece in comparison with pulse duration and pulse off-time.
438
Authors: Guang Ming Jiao, Dun Wen Zuo, Min Wang
Abstract: The development history and situation of Chinese manufacturing enterprise
informationization are reviewed in this paper. Based on practice, the problems of Chinese enterprise
informationization are discussed on in view of understanding, methods and implementation, and
difficulties are explained. At last, methods of Enterprise Information are proposed.
514
Authors: Ming Wang, Shi Hong Shi, Dun Wen Zuo, Min Wang
Abstract: In modern surface modification manufacturing technology, laser cladding is a high-tech
which has good prospects for development. However, for the large area laser cladding surface
modification, there has the contradiction between cladding efficiency and cladding accuracy of the
cladding. If using the smaller spot, it will be inefficient, if the spot increasing, the accuracy of
marginal part of the cladding will be poor, the "stage effect" will be obvious. The variable spot
powder feeder is designed, and the variable spot cladding process with small facula outlining border
and big facula filling in central section is introduced, which resolves the contradiction between the
two effectively. Experimental proves that surface quality with variable spot cladding is better. In the
overlap area, due to the second lixiviation caused by repeated heating, the microhardness value of
multi-track overlap cladding is higher than the structure in the non-overlap area.
319
Authors: Feng Xu, Dun Wen Zuo, Wen Zhuang Lu, Min Wang, Hai Yu Zhang
Abstract: High residual stress that includes thermal and intrinsic stress is an obstacle to the further
application of chemical vapor deposited diamond thick film. In this paper, CVD diamond thick film
was deposited on silicon substrate by hot filament chemical vapor deposited (HFCVD) system. The
finite element analysis (FEA) simulation and experimental research were carried out on the thermal
and intrinsic stress of large area diamond thick film. The FEA model is set up to investigate the
distribution and magnitude of thermal stress. The intrinsic stress is studied by X-Ray diffraction
“sin2ψ” method. The thermal stress and intrinsic stress are both compression stress. Simulation
results show the discontinuous sharp of the diamond film result in the stress concentration and low
cooling velocity is a good way to reduce thermal stress. The intrinsic stress is correlative with the
microstructure and non-diamond component of diamond film. The origin of the intrinsic stress is
discussed in detail in this paper.
123
Authors: Wen Zhuang Lu, Dun Wen Zuo, Min Wang, Feng Xu
Abstract: Electroplated Cr, Ni and Cu were used as interlayer for chemical vapor deposition (CVD)
diamond coating on WC–Co cemented carbide cutting tools. The electroplated interlayers were
studied by Scanning Electron Microscope (SEM), Electron Probe Micro Analyzer (EPMA) and
X-ray diffraction (XRD). The CVD diamond coatings were studied by SEM and Raman Scattering
Spectroscopy (Raman). The experimental results show that there is diffusion bonded interface
between electroplated layer and WC-Co substrate after H plasma treatment, the bond between
electroplated layers and WC-Co substrate changes from mechanical bond to metallurgical bond and
the adhesion becomes stronger. Electroplated Cr interlayer forms new phases of Cr3C2 and Cr7C3
under CVD conditions, while electroplated Ni and Cu interlayers do not form carbides under CVD
conditions. Cr carbides have good chemical compatibility to diamond, and they are propitious to
diamond nucleation and growth during the deposition period. The diamond crystal microstructure,
diamond quality and adhesion on Cr interlayer are better than those on electroplated Ni and Cu
interlayers.
92
Authors: Yu Li Sun, Dun Wen Zuo, Duo Sheng Li, Rong Fa Chen, Min Wang
Abstract: Hardness, elastic modulus and scratch resistance of single silicon wafer are measured by
nanoindentation and nanoscratching using a nanoindenter. Fracture toughness is measured by
indentation using a Vickers indenter. The results show that the hardness and elastic modulus at a peak
indentation depth of 100 nm are 12.6 and 166.5 GPa respectively. These values reflect the properties
of the silicon wafer, the bulk material. The fracture toughness value of the silicon wafer is 0.74
Mpa·m1/2. The material removal mechanisms are seen to be directly related to the normal force on the
tip. The critical load and scratch depth estimated from the scratch depth profile after the scratching
and the friction profile are 138.64 mN and 54.63 nm respectively. If the load and scratch depth are
under the critical values, the silicon wafer will undergo plastic flow rather than fracture. The critical
scratch depth is different from that calculated from the formula of critical-depth-of-cut described by
Bifnao et al and some reasons are given.
52
Authors: Rong Fa Chen, Dun Wen Zuo, Wen Zhuang Lu, Duo Sheng Li, Feng Xu, Tong Ji, Min Wang
Abstract: In the present work, high power DC arc plasma jet chemical vapor deposition (CVD) is
used to prepare diamond films with full width half magnitude (FWHM) less than 10 wave numbers
at 1332 cm−1 Raman peak. During the polishing process, diamond film is hold against the stainless
steel holder, which rotates and swings when the sample comes into contact with the cast-iron plate.
Average surface roughness of the forming nucleus polished surface and growing polished surface is
560nm, 90nm respectively. And the materials removal rate is quite different. Fine crystal grain of
the forming nucleus surface and the thick column crystal of growing surface are dominant in
structure. In the meantime, effects of the size of the abrasive power, the applied force and polishing
direction are also discussed. A profilometer, an Raman spectroscopy, X-ray diffraction and a
scanning electron microscope have been used to evaluate the surface states of diamond films before
and after polishing. This result reveals an. improvement of polishing efficiency and a great potential
for commercial application.
285
Authors: Ming Wang, Kang Min Zhong, Dun Wen Zuo, Min Wang
Abstract: Nowadays, the research on the greenization of clamping technology obviously lags the
research of green cutting, green machine tool etc. This paper provides a new clamping system to
clamp the workpiece by the green fast heating/cooling adverse-change semiconductor technology
and temperature controllability to thermal sensitive medium with volume effect. This clamping
system has a low speed operating part, few moving parts, low medium leakage and noise pollution
and it is convenient to be flexible configuration of multi-place, multi-workpiece and multi-direction
clamping. Furthermore, the clamping system can use the sensors of temperature, pressure and
displacement to collect the relative data and process them by computer, then intelligently control the
clamp force and clamping displacement.
1028
Authors: Wen Zhuang Lu, Dun Wen Zuo, Min Wang, Feng Xu
Abstract: Chemical vapor deposition (CVD) diamond coatings were deposited on cemented carbide
cutting cools by an electron-assisted hot filament chemical vapor deposition (EACVD) equipment
developed by the authors. The CVD diamond coatings were studied by Scanning Electron
Microscope (SEM) and Raman Scattering Spectroscopy (Raman). The experimental results show that
CH4 concentration in the source gas performs great influence on the micro-structure, surface
roughness, composition, residual stress and adhesion of the CVD diamond coatings. The increase of
CH4 concentration results the change of diamond crystal from {111} orientation to {100} orientation,
the decrease of the surface roughness and the increase of sp2 carbon in the CVD diamond coatings. A
residual compressive stress exists in the CVD diamond coatings. The residual stress decreases with
increasing CH4 concentration. A higher or lower CH4 concentration tends to reduce adhesion stress of
the continuous CVD diamond coatings.
480