Authors: Ming Wang, Kang Min Zhong, Dun Wen Zuo, Min Wang
Abstract: The green fixture is the research focus, but the current research is centralized on the fixture driven by the air. It will lead to a noise polution and a small clamping force. Using the green electromagnetic conversion technology, a new clamping system to clamp the workpiece is provided, which is composed of the giant magnetostrictive material as working medium and the displacement amplifier with the area effect. This device can realize the flexible configuration of clamping at multi-place, for multi-workpiece and in multi-direction. Furthermore, this clamping system using the A/D converter and the sensor technology of pressure and displacement to collect the relative data, the collected data can to be putted in the computer and be processed,so it is easy to control the clamp force and clamping displacement intelligently.
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Authors: Bing Kun Xiang, Dun Wen Zuo, Duo Sheng Li, Rong Fa Chen, Ming Wang
Abstract: Micro-nanocrystalline diamond (M-NCD) Film may be successfully prepared on Mo substrate with DC arc plasmas jet deposition device. This paper studies the influences of carbon source concentration on the shape of M-NCD Film particles under circumstances of stable electric arc, and characterizes the grain size and quality of samples through SEM, AFM and Raman spectrum. The research result shows that, in the state of stable electric arc, relatively low carbon source concentration (1%) could deposit high-quality microcrystalline diamond film on the substrate, with a growth rate of up to 8.3μm/h and grain size of about 2~4μm; relatively high carbon source concentration (10% or 15%) could deposit high-quality nanocrystalline diamond(NCD) film on the microcrystalline diamond film at high speed, with a growth rate of up to above 12.6μm/h or 19.7μm/h, grain size of about 4~80nm and average grain size of 27.4nm.
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Authors: Ming Wang, Shi Hong Shi, Dun Wen Zuo, Min Wang
Abstract: In modern surface modification manufacturing technology, laser cladding is a high-tech
which has good prospects for development. However, for the large area laser cladding surface
modification, there has the contradiction between cladding efficiency and cladding accuracy of the
cladding. If using the smaller spot, it will be inefficient, if the spot increasing, the accuracy of
marginal part of the cladding will be poor, the "stage effect" will be obvious. The variable spot
powder feeder is designed, and the variable spot cladding process with small facula outlining border
and big facula filling in central section is introduced, which resolves the contradiction between the
two effectively. Experimental proves that surface quality with variable spot cladding is better. In the
overlap area, due to the second lixiviation caused by repeated heating, the microhardness value of
multi-track overlap cladding is higher than the structure in the non-overlap area.
319
Authors: Yu Li Sun, Dun Wen Zuo, Yong Wei Zhu, Ming Wang, H.Y. Wang, Li Gang Zhao
Abstract: The friction behavior of single silicon wafer sliding against different ice counterparts
(α-Al2O3, CeO2 and SiO2) at 10±0.5 °C within a velocity of 60 rpm~300 rpm were studied using a
home-made friction and wear testing machine. The morphologies and surfaces roughness of the worn
silicon wafers were observed and examined on a non-contact surface topography instrument (ADE). It
was found that the friction coefficient of the single silicon wafer decreased with the increase of sliding
velocity. Single crystal silicon wafer coupled with α-Al2O3 ice counterpart recorded the highest
friction coefficient and the biggest surface roughness, while it had the lowest friction coefficient and
the smallest surface roughness as with CeO2 ice counterpart. One reason was that a series of
tribochemical reactions occurred at the local contact point between the ice counterpart and the silicon
wafer during sliding. Under alkaline condition, there would be a soft corrosion layer formed on the
surface of the silicon wafer. Another reason was that the hardness of the abrasive particles was
different and this caused different cutting depth of them.
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Authors: Ming Wang, Dun Wen Zuo, Min Wang, Shi Hong Shi, Chun Yao
Abstract: According to lateral powder system due to gravity, the controllable rapid powder switch
is first tried based on the principle that air pressure can change the direction of power. Then, three
kinds of modified schemes are provided based on the experiment to remedy the lack of first try.
Finally, one scheme is selected and realized, which can solve the problem of synchronization of
laser and powder, and advance powder utilization factor.
686
Authors: Yan Nian Rui, Ming Wang, W.J. Liu, Dun Wen Zuo, M. Wang
Abstract: According to dyeing and printing wastewater of high chroma and difficult
decomposition, a new ultrasonic focalize decomposition method is provide, which can decompose
those are difficult to do. In this article, Dynamic adding-pressure dissolving-air, ultrasonic focalize
and flocculate floating-air are assembled to advance the treatment effect. Through the research, the
dynamic models of adding pressure and dissolving air and flocculate floating-air are constructed.
Based on the theory research, a experiment device is designed. The effect and influence factors are
discussed, which provides a new way to process dyeing and printing wastewater of high chroma and
difficult decomposition.
588
Authors: Ming Wang, Kang Min Zhong, Dun Wen Zuo, Min Wang
Abstract: Nowadays, the research on the greenization of clamping technology obviously lags the
research of green cutting, green machine tool etc. This paper provides a new clamping system to
clamp the workpiece by the green fast heating/cooling adverse-change semiconductor technology
and temperature controllability to thermal sensitive medium with volume effect. This clamping
system has a low speed operating part, few moving parts, low medium leakage and noise pollution
and it is convenient to be flexible configuration of multi-place, multi-workpiece and multi-direction
clamping. Furthermore, the clamping system can use the sensors of temperature, pressure and
displacement to collect the relative data and process them by computer, then intelligently control the
clamp force and clamping displacement.
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Authors: Yan Nian Rui, Ming Wang
Abstract: The scale structure and the experiment equipment are designed on the nano ferrofluidic
scale the string axle of the big length to radius, according to the principle of the nano ferrofluidic
scale. The experiment study is made on the problems of the scale performance relation associated
with this string axle, the rotational speed and the excitation current big or small. The reliability of
the nano ferrofluidic scale the string axle of the big length to radius is proved.
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Authors: Yan Nian Rui, Ming Wang, Dun Wen Zuo, Min Wang
Abstract: As we know, it is a useful method to prolong cupping mould lifecycle by employing
diamond as cupping mould, especially to cupping mould of cupping horniness material. However,
the machining of diamond cupping mould is always difficult. The paper intends to use the method
of ultrasonic and electric spark combined to process diamond cupping mould. Based on the theory
research and experiment, a satisfied result is attained. The experiment proves that the method is
feasible, which decreases not only the chances of short-circuit in the process but also the energy
consumption and improves machining efficiency significantly. These advantages are obvious.
10
Authors: Wolfgang Bleck, Ming Wang, Dun Wen Zuo, Min Wang, Yan Nian Rui
Abstract: How to improve the surface quality of large-scale silicon wafer in the ultra-precision
grinding process, will always be the most important issue discussed by the silicon wafer
manufacturer. In this paper, the advantage of ultrasonic grinding is being explored. These
advantages included small macro grinding force, grinding stress, low grinding heat, which will
reduce the surface damage. Combined with relatively abrasive, a large-scale silicon wafer can be
processed. Through the study, an experimental system for ultrasonic grinding of large-scale silicon
wafer is designed. The working parameter is optimized and the expected result is obtained, which
searches a new way for the practical implementation.
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