Papers by Author: No Jin Park

Abstract: Mg alloys are drawing a lot of attention and have been extensively studied. The major obstacle to the practical application of the alloys is the poor formability at room temperature, originating basically from the insufficient number of slip system. Development of a proper microstructure and/or texture is one promising solution to improve the formability. In the present work, after extrusion and full annealing, rolling at 300°C with different starting textures, the microstructures, texture developments and tensile properties of AZ31 Mg alloys are studied. After full annealing strong ∥ED fiber texture and weak + ∥ED fiber texture (c-axes in the radial direction) were developed. After rolling at 300°C many twins were formed, and the strong ∥ED fiber texture changed to ∥ND texture. Yield strength, tensile strength and elongation changed obviously depending on the microstructure and textures.

Abstract: In this study, the magnesium alloys AZ31, ZK10, and ZEK100 are investigated through microstructure, texture, and tensile test. The sheets were hot rolled, and different results were found for different chemical compositions. The contained elements affected the grain size, shear band, twins, and intensity of the basal texture of the magnesium alloy. Thus, if a magnesium sheet had finer grains and a weak (00.1) texture because of its chemical composition, it had the most favorable formability.

Abstract: Magnesium alloys have attracted a great deal of attention and have been extensively studied, but there is still a major obstacle to their practical application, namely, their poor formability at room temperature, which basically originates from their insufficient number of slip systems. The development of a microstructure and/or texture that is more conducive to formability is one promising solution that could improve their formability. In the present work, the microstructures, textures, and tensile properties of AZ31 Mg alloys are studied following extrusion and full annealing and rolling at 100 and 300°C. After full annealing, a strong ∥ED fiber texture and a weak + ∥ED fiber texture (c-axes in the radial direction) were developed. After 40% rolling at 100°C, many deformed twins were observed and a relatively weak texture was developed. The basal poles were split and rotated about 20° to the rolling direction (RD). During 60% rolling at 300°C, dynamic recrystallization (DRX) took place and a strong ∥ND fiber texture was developed, and this had an influence on the alloys’ poor formability at room temperature.

Abstract: Desirable magnetic properties for grain oriented electrical steels are low core loss and high magnetic flux density. These properties are closely related with sharpness of {110} texture. This Goss texture develops by abnormal grain growth during secondary recrystallization annealing. Based on experimental results, a general suggestion which estimates the magnetic properties after completion of secondary recrystallization from a primary recrystallized texture can be proposed. For a material to have better magnetic properties after completion of secondary recrystallization, it should have a primary recrystallized texture in which there are not only large number of ideal Goss grains, but also lower frequency of low angle grain boundary around those Goss grains.

Abstract: Titanium silicon carbide (Ti₃SiC₂) is a remarkable material for its combination of the best properties of metals and ceramics. The high purity Ti₃SiC₂ ceramic has been prepared by infiltration sintering (IS), and the effect of a small amount of Si on Ti₃SiC₂ ceramic formation was investigated. The results show that the purity of Ti₃SiC₂ ceramic could be increased significantly and the sintering time for Ti₃SiC₂ could be decreased remarkably when proper amount of Si was added in the starting mixture. The Ti₃SiC₂ sintered compact with a purity of 99.2wt% and a relative density of 97% was obtained by the infiltration sintering from a starting mixture composed of n(Ti):n(Si):n(TiC) = 1:0.3:2 at 1500 °C with holding time of 2/3h.

Abstract: In this study, the microstructure and the texture development in Al–Zn–Mg–Cu–Zr alloys with/without 0.1%Sc has been investigated after extrusion, cold rolling, and aging treatment. After aging treatment, in Al alloy without Sc recrystallized equiaxed grains are obtained, while in Al alloy with Sc fine grains with an average size of 0.1~0.3 μm are obtained. After cold rolling, in case of the sample from the cross section (CS) to which Sc was added, texture with {112}<111>(Cu) + weak {123}<634>(S) component was developed while in case of the sample from longitudinal section (LS) to which Sc was added, texture with strong β-fiber + {110}<001>(Goss) components was developed. In case of CS and LS without Sc, texture of β-fiber was developed. After solid solution treatment and aging treatment, Al alloys (LS and CS) with Sc had rolling texture while Al alloys without Sc had random texture. The role of these differently developed textures in the plastic behavior, such as the normal anisotropy r-value (the plastic strain ratio) and planar anisotropy
r-values are discussed.

Abstract: For optimum fabrication and usage of Cu films, an understanding of the relationship between processing and microstructure is required. The existence of twins is another significant factor for texture development in Cu films. Texture character and strength in the Cu film is dependent on the twin boundary development that is a function of processing conditions and film thickness. In this study, determination of grain growth and texture in the sputtered and electroplated Cu films during annealing was performed for films of 100, 480 and 850 nm in thickness deposited on a Ta(25 nm)/Si wafer. The texture was measured by X-ray pole figure. The effect of film thickness on the annealing texture in the sputtered and electroplated Cu films is examined and discussed.

Abstract: TiN thin films are widely used as a coating material due to their good mechanical and conductivity properties, high thermal properties, strong erosion and corrosion resistance. Also TiN has been used in Si devices as a diffusion barrier material for Al and Cu-based metallization. The uniform and dense structure of thin films is influenced by the texture of films. It was good to have uniform and dense structure and bad to have an open columnar structure in TiN thin films. Therefore, the property of diffusion barrier of the TiN films in semiconductor also is related to the texture and microstructure of TiN coated layer. In this study, the relationship between the texture and microstructure and the best diffusion barrier propertiy of TiN coated films (by PVD and MOCVD) on semiconductor devices (Cu/TiN/SiO2/Si layer) were investigated under different processing conditions and textures. The property of diffusion barrier for Cu of physical vapor deposited TiN thin films is better than that of metal organic chemical vapor deposited TiN thin films. Also the property of diffusion barrier for Cu of (111) textured TiN thin films is better than that of (200) textured TiN thin films.