Papers by Author: Ryo Hattori

Abstract: Effects of implantation temperature on electrical properties of heavily-Al-doped 4H-SiC layer formed with Al implantation have been investigated. To form the p++ 4H-SiC with the original 4H-stacking structure, the implantation temperature above 175 °C is needed. A decrease in the implantation temperature below 250 °C leads to an increase in the NA-ND. It is suggested that an increase in the density of vacancies with a decrease in the implantation temperature promotes the Al substitution to lattice sites during activation annealing. The lower-temperature implantation also causes a decrease in activation energy for the p-type electrical conduction and a decrease in p-type ohmic contact resistivity. We presume that the increase in the Al acceptors at low-implantation temperatures gives expansion of the impurity bands and formation of valence band tail-states, causing the decrease in the impurity binding energy. The properties obtained with the lower-temperature implantation are desirable for practical applications especially at low temperatures.

Abstract: Depth profiles of ion-implantation induced defect centers have been investigated by cross-sectional CL measurements in the energy range from visible to near infrared. CL observation has shown that point defects diffused out from implanted region to ~10 µm depth during activation annealing. Annealing temperature dependence of the depth distribution of CL intensity of these defects has suggested that structural transformation of point defects proceeds as “silicon vacancy (VSi) → carbon vacancy-antisite pair (VC-CSi ; UD2) → antisite pair (CSi-SiC ; DI)”.

Abstract: LPE (liquid phase epitaxy) growth of low nitrogen unintentionally doped SiC epitaxial layer on on-axis 4H-SiC substrate using nitrogen getter Si based solution was investigated to realize basal plane dislocation (BPD) free epitaxial layer. A significant reduction in BPD was demonstrated.

Abstract: We performed liquid phase epitaxial growth of SiC layers on on-axis 4H-SiC substrates using Si solvent. It was found that the polytype controllability of the epilayer significantly depends on the growth process conditions. By optimizing them, polytype mixing in the epilayers can be completely suppressed. It is shown that the density of basal plane dislocations in the epilayers is much less than in the substrates due to on-axis growth. SIMS analysis showed that the concentrations of trace impurity elements (B,Al,Ti,V,Cr,Fe,Ni,P) in the epilayers are under lower detection limit. The only impurity is nitrogen resulting in an n-type layer. Carrier concentrations Nd-Na ranging from high 1016 to low 1017cm-3 are achievable.

Abstract: Two types of in-grown stacking faults in 4H-SiC epitaxial layers (SFs) were investigated using a new photoluminescence (PL) topographic imaging system, macro/micro PL mapping system, TEM and molten KOH etch pit observation. Shockley type SFs (SSFs) of 3C and 8H inclusion were identified as two different types of triangular PL emission patterns with corner angle of 60° and 30° spreading to the <11-20> down step direction. The peak wavelengths are 423nm and 465nm, respectively. The 60° triangular SSFs are 3C inclusion related with threading edge dislocations. The 30° triangular SSFs are 8H inclusions related with basal plane dislocations. Such SFs are caused by dislocation- related disturbance of the step flow growth resulting in insertion of new cubic sites in between the 4H hexagonal turns. The substrate surface roughness at the early stage of the epitaxial growth and the growth rate may correlate with the might be deeply related in the SFs formation of SFmight be deeply related in the SFs.

Abstract: Cross-sectional CL measurements have been performed on the cleaved surface of the Al-ion implanted 4H-SiC. The strong L1 luminescence that originates from the DI defect has been observed even in the deep region (~10 μm) where implanted ions do not penetrate. In the implanted layer, CL results show that high-density non-radiative defects remain even after activation annealing. Generation of the DI defect in the deep region is presumably attributed to the diffusion of point defects from the implanted layer.

Abstract: Crystalline recovery mechanism in the activation annealing process of Al implanted 4H-SiC crystals were experimentally investigated. Annealing temperature and annealing time dependence of acceptor activation and activated hole’s behavior were examined. Poly-type recovery from the implantation induced lattice disordering during the annealing was investigated. The existence of meta-stable crystalline states for acceptor activation, and related scattering centers due to annealing is reported To achieve 100% acceptor activation and to reduce strain after ion implantation, annealing at 2000°C for 10 min. was required.

Abstract: Solution growth on off-axis 4H-SiC sublimation substrate as a buffer layer for the subsequent CVD epitaxial growth was investigated. Dislocation conversion and propagation from the substrate to the CVD epitaxial layer through the solution grown buffer layer was inspected by molten KOH etch pit observation. Effective dislocation conversion from BPD to TED as an effect of the buffer layer insertion with no drastic change in the total EPD was confirmed.