Papers by Author: Seong Hyuk Lee

Abstract: A novel electrically conductive adhesives (ECAs) with solder particle have been developed. The kinetics of the curing reaction were investigated using isothermal differential scanning calorimeter (DSC). The dynamic DSC scans were also conducted to investigate the temperature dependant curing degree. The temperature dependant viscosity characteristic of polymer was investigated using rheometer. The wetting characteristic of two solders on two kinds of metals were investigated using an optical microscope. It was found that developed resin material showed good fluxing capacity against Sn-Bi solder on Ni/Au and the wetting angles was about 24º.

Abstract: A new hybrid soldering and conductive adhesive joining technology using a fusible lowmelting- point alloy (LMPA) have been developed. A numerical method for numerical analysis of fusible particles behavior is proposed to investigate coalescence characteristics of fusible particles in solderable isotropic conductive adhesives (ICAs). For finding out suitable conditions to obtain reliable conduction paths, the present study examines the influence of process-related parameters such as volume fraction and viscosity on coalescence characteristics of fusible particles.

Abstract: The ultimate goals of this study are to investigate numerically nonequilibrium energy transfer between electrons and phonons, and to predict the crater formation shapes of gold thin film structures irradiated by femtosecond pulse lasers. In particular, the present article expands the onedimensional two-temperature model (1DTTM) to the two-dimensional model (2DTTM) considering wave interference, and it involves the quantum effect to predict thermal and optical properties. The predictions by using 2DTTM are extensively compared with those of 1DTTM, and the influence of film thickness on radiation heat transfer and optical characteristics are also examined. From the results, it is found that the predictions of 2DTTM are in good agreement with those of 1DTTM. As the gold film thickness decreases, the reflectivity decreases dramatically and the absorbed laser intensities at the top surface increases substantially because of wave interference in thin films.