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Articles by author: Shao Hui Yin

• Application of Ultrasonic Vibration Shoe Centerless Grinding Technique to Micro-Scale Parts Fabrication
  Published in: Manufacturing Science and Engineering I (p2518)
• Development of Ultra-Precision Grinding Process for Aspheric Surface Based on Feed Rate Controlling and Error Compensation Methods
  Published in: Manufacturing Science and Engineering I (p2192)
• Effects of Horizontal Vibration Assistance on Surface Roughness in Magnetic Abrasive Finishing
  Published in: Advances in Abrasive Technology XII (p246)
• Error Compensation in One-Point Inclined-Axis Nanogrinding Mode for Small Aspheric Mould
  Published in: Manufacturing Science and Engineering I (p4206)
• Formation Mechanism and Simulation of Oxide Film in Electrodeless ELID Grinding
  Published in: Manufacturing Science and Engineering I (p2961)
• Influences of Polishing Tool’s Shape on Surface Roughness in Magneto-Rheological Finishing
  Published in: Manufacturing Science and Engineering I (p4092)
• Material Removal Mechanism in Vibration-Assisted Finishing
  Published in: Ultra-Precision Machining Technologies (p158)
• Material Removal Mechanism in Vibration-Assisted Magnetic Abrasive Finishing
  Published in: Surface Finishing Technology and Surface Engineering (p57)
• Modeling and Computer Simulation of Grinding for Ball-End Milling Cutter with Equal Normal Rake Angle
  Published in: Surface Finishing Technology and Surface Engineering (p225)
• Nozzle-Type ELID Grinding Characteristics of Cemented Carbides
  Published in: Advances in Abrasive Technology XIII (p1007)
• Numerical Simulation on Two-Step Isothermal Glass Lens Molding
  Published in: Advances in Abrasive Technology XIII (p564)
• One-Point Nano-Grinding for Micro-Aspherical Glass Lens Mould
  Published in: Manufacturing Science and Engineering I (p4217)
• Optimum Geometrical Arrangement of Workpiece in the Ultrasonic Vibration Shoe Centerless Grinding
  Published in: Manufacturing Science and Engineering I (p4100)
• Surface Roughness Characteristics of Fine ELID Cross Grinding for Silicon Wafers
  Published in: Manufacturing Science and Engineering I (p4106)