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Articles by author: Tae Sung Oh

• Bump Formation and Flip Chip Processes for RF System-on-Packages
  Published in: Advances in Nanomaterials and Processing (p25)
• Effects of the Additives and Current Density on the Electrodeposition Behavior and Mechanical Properties of the Ni-SiC Composite Coatings
  Published in: The Mechanical Behavior of Materials X (p1533)
• Electrodeposition of Bi₂Te₃ for Nanowire Application
  Published in: Designing, Processing and Properties of Advanced Engineering Materials (p377)
• Fabrication of Diamond Dispersed Nickel Composite Coating by Electroplating Method to Enhance the Mechanical Property of Coating
  Published in: The Mechanical Behavior of Materials X (p1597)
• Ferroelectric Characteristics of Sr_xBi_2.4Ta₂O₉ Thin Films and Electrical Properties of the Pt/Sr_xBi_2.4Ta₂O₉/TiO₂/Si Structure
  Published in: Designing, Processing and Properties of Advanced Engineering Materials (p477)
• P-Type and N-Type Bi₂Te₃/PbTe Functional Gradient Materials for Thermoelectric Power Generation
  Published in: Progress in Powder Metallurgy (p1493)
• Reaction between Sn-In Solder and Under Bump Metallurgy
  Published in: Designing, Processing and Properties of Advanced Engineering Materials (p401)
• Thermoelectric Characteristics of the Electrodeposited (Bi,Sb)₂Te₃ Films with Variation of the Electrodeposition Current Density
  Published in: Eco-Materials Processing and Design VIII (p917)