Papers by Author: Timothy Bogart

Abstract: Semi-insulating silicon carbide (SiC) wafers are important as substrates for high frequency devices such as AlGaN-GaN HEMT’s. A nondestructive characterization technique has been developed to measure the dielectric properties of SiC wafers in the GHz frequency range where the devices will operate in order to validate wafers for high yield working devices. The dielectric loss is measured at approximately 16 GHz in a split microwave cavity. Initial results show a correlation where the dielectric loss decreases as the resistivity increases, where the resistivity was measured using a Contactless Resistivity Mapping system (COREMA). The uniformity of dielectric loss across SiC wafers was evaluated using a split post dielectric resonator cavity fixed at 5.5GHz to measure the dielectric loss at five points on a wafer. Dielectric loss as a function of temperature from room temperature to 400°C was also studied.

Abstract: For undoped 6H-SiC boules grown by physical vapor transport the variations of resistivity, of the type and density of deep electron and hole traps, and of the concentration of nitrogen and boron were studied as a function of position in the cross section normal to the growth axis and along the growth direction. It was observed that the concentrations of all deep electron and hole traps decreased when moving from seed to tail of the boule and from the center to the edge of the wafers. Modeling of the growth process suggests that the C/Si ratio increases in a similar fashion and could be responsible for observed changes. We also discuss the implications of such stoichiometry changes on compensation mechanisms rendering the crystals semi-insulating and on electrical uniformity of SI-SiC wafers.