Papers by Author: Tsutomu Ohta

Abstract: This paper investigates the deformation in monocrystalline silicon subjected to single-point cutting with the cutting speed up to 46.78 m/s, the depth of cut of 2 μm, and the feed rate of 5 and 30 μm/rev. Raman spectroscopy and transmission electron microscopy were used to characterize the subsurface damages. It was found that the increase of either the feed rate or cutting speed increases the thickness of amorphous layer and penetration depth of dislocations. At the feed rate of 30 μm/rev and cutting speed of 12.48 m/s, a new dislocation system was initiated. An unknown peak was detected by Raman spectroscopy, which may indicate an unknown Si phase.

Abstract: The service life of a diamond tool in cutting single-crystal silicon is normally very short because of severe tool wear. Therefore, it is important to use a proper coolant in order to restrain tool wear. In this paper, the performances of oil-based and water-based coolants were compared in silicon machining by investigating cutting forces and tool wear geometries. The water-based coolant was found to restrain flank wear more effectively than the oil-based one. The effective tool life using the water-based one was averagely three times longer than that using the oil-based one. The tool wear mechanism might be related to microplasma generated between silicon and diamond during cutting.