Papers by Author: Y.M. Ali

Abstract: This paper experimentally investigates the effect of time and pressure on the condition of polishing pads and the material removal rate (MRR) of single crystal silicon. It was found that as the pad deteriorates with time, MRR decreases. Surfaces with a required quality can only be achieved before the texture deterioration reaches a critical limit. At a higher pressure, 25 kPa, deterioration is slower, and the effective life of pads and MRR is enhanced.

Abstract: This paper experimentally investigates the micro-structural changes in mono-crystalline silicon induced by abrasive polishing with abrasive grain size and applied pressure. It was found that while the large abrasives of about 15 μm and 300 nm in diameter induce both residual amorphous phase and various residual crystalline structures and dislocations, the finer abrasives of about 50 nm in diameter only produce residual amorphous phase in the top subsurface of polished silicon. With the fine abrasives, reducing applied pressure reduces the amorphous layer thickness, and a damage-free polishing can be achieved at the pressure of 20 kPa.

Abstract: This paper presents a comprehensive model for predicting surface roughness due to grinding. Fuzzy rules are provided, to estimate roughness for any practical combination of (1) wheel hardness grade, (2) abrasive grain size, (3) dressing condition, (4) table speed, (5) wheel depth of cut, and (6) coolant application. The rule-base can be adapted to account for the effect of (7) different workpiece material hardness, (8) wheel rotational speed, and (9) equivalent wheel diameter. The 86 rules are intuitive, and are particularly useful for production and/or embedded control applications.