Papers by Author: Zhi Cheng Feng

Abstract: The fabrication of butterfly-shape resonator is key for high precision resonator, for requiring suspend on the silicon substrate. This paper is focused on the technology of making butterfly-shape resonator. the variety of structure design can be used to make butterfly-shape resonator have been analyzed, the structure of butterfly-shape resonator is obtained, and for reducing the etch surface roughness, KOH etching conditions, such as composition, concentration, and temperature of etch solution, have been done. Combining with above testing results, the structure design and optimization KOH etching technology are obtained ,based on the technology, using the boron etch stop technique , the silicon butterfly-shape resonator has been done, it can be used effectively in the fabrication of the silicon resonant sensor.

Abstract: pressure sensor, CrSi resistor networks, temperature compensation. Abstract. In this paper, focused on especial requirement monolithic integrated resistance pressure sensor, pressure structure, signal processing circuits and process compatible technology of sensor and IC were studied. The feebleness pressure signal monitoring circuits was designed, high precision CrSi resistor networks was used for temperature compensation of resistance pressure sensor, and a monolithic integrated pressure sensor only 2.3×2.3mm2 was obtained. The measuring results are as follows, measurement range is 5-115kPa, the maximum Vout is more than 4.5V, sensitivity is 1.2%.

Abstract: Aiming at the severe effect of poly-silicon deposition process on the performance of semiconductor bridge, experiments were made on optimization of poly-silicon deposition to obtain optimal process conditions. Resistance of the poly-silicon semiconductor bridge was stabilized 1±0.07Ω, satisfying its application requirements.