Papers by Keyword: Aerosol Deposition Method

Abstract: Equipment was designed for the application of Al₂O₃ thin films by the aerosol deposition method (ADM) at room temperature. Al₂O₃ film could be deposited on Pyrex-glass, indium tin oxide (ITO), polyvinyl chloride (PVC) plastic, single crystal silicon, and sapphire substrates. The films had the same crystal structure as the raw material particles and were highly transparent. The breakdown electric field of the Al₂O₃ film for the ADM was more than 35 kV/mm.

Abstract: Freestanding BaTiO₃ ceramics films were fabricated using the aerosol deposition (AD) method and the size effect of nanograined BaTiO₃ ceramics was demonstrated. Dense BaTiO₃ thick film fabricated by the AD method was crystallized and detached from substrate by an annealing treatment at 600 °C, and then the grain size was controlled by a reannealing treatment at various temperatures. As a result, freestanding BaTiO₃ thick films with various grain sizes from 24 to 170 nm were successfully obtained. Polarization–electric field (P–E) measurement revealed that BaTiO₃ ceramics with grain sizes of more than 58 nm showed ferroelectricity, whereas BaTiO₃ ceramics with an average grain size of 24 nm showed paraelectricity at room temperature. Dielectric measurement indicated that the permittivity decreased with decreasing grain size in the range of 170 to 24 nm.

Abstract: In the aerosol deposition method (ADM), we investigated an influence of pre-treatments for barium titanate powders as raw material on the deposition rate of thick films. By sieving and drying the powder, deposition rate of the films fabricated by ADM was effectively enhanced. On the other hand, heating the powders at 400-800°C, the resulting powders caused low deposition rate of the films. When a planetary milling was performed prior to charge aerosol chamber, the deposition rate of the films was four times higher than that in deposition using the powder without milling. By changing the milling rotation rate, we control size of agglomerated particles consisting of powders, which results in the control of deposition rate of the films.