Papers by Keyword: Anti-Vibration

Paper TitlePage

Abstract: In order to improve the anti-vibration performance of the Ball Grid Array solder joints, its solid model is established in ANSYS. Analyzing the stress response under the shock and vibration environment by using the finite element method. Then discussing the stress response of solder joints with different diameters and different heights in the same shock and vibration environment of each location for providing the basis for anti-vibration design. The results show that the longer diameter and lower height solder joint is more favorable to improve its anti-vibration performance.
103
Abstract: To improve the anti-vibration capability of silicon mcrogyroscope, making it works well under the vibration environment, this paper analyzes the dual-mass silicon mcrogyroscope and did the following works. First of all, the operating principle, analysis parameters of silicon microgyroscope and the vibration condition are introduced. Secondly, this paper proposes a vibration analysis method base on the signal conversion between time domain and frequency domain and establishes a Simulink demodulation model according to circuits of silicon microgyroscope. Finally, we get the conclusion that under the condition of vibration, composition with the same frequency of Vds in Vsense signal is the main influence factor of bias stability by analyzing experimental data. This has a great significance for improving the anti-vibration capability and guiding the interior structure design of silicon microgyroscope.
1310
Abstract: The conductor is an important part of the process of power transmission. Keep conductor to be normal operation is an important link of power transmission. In practice, Due to the influence of many weather environments, such as wind, temperature, rain and snow, the conductor often appear ice disaster, dance and other disasters; therefore, the anti-vibration technology of conductor is an urgent need to develop. This paper masters the performance of damper by carrying out a great deal of performance test analysis, such as self-damping, the power of damper, anti-vibration effect. At the same time, this paper understands the effect of spacer arrangement on the sub span oscillation, through the finite element analysis and lingo program of nonlinear programming, laying the foundation for studying anti-vibration technology for large cross-section conductor.
522
Abstract: Taking paper tearing resistance apparatus as an example, study on the transport packaging of small test equipments has been conducted. It has analyzed the existing problems in the current packaging and improved in three aspects, namely rustproof packaging, buffering and ant-vibration packaging and external packaging container. It has also illustrated the selection in materials, dimensional calculation and check, approaches and procedures for structural design, which not only offers a set of economical and environmental protective transport packaging plans with simple structure, but also provides cases and references for other small test equipment.
143
Abstract: A silicon micro-machined gyroscope without the driven conformation is introduced. The structure of the silicon micro-machined gyroscope are researched and designed to withstand vibration and shock at the request of the rotation carrier. The different methods including changing the epoxy resin and sealing shell with laser are carried out and proofed by experiment verification.
34
Abstract: Vibration is the biggest problem for precise on-line surface measurement. In order to investigate the possibility for phase-shifting interference technique to be applied to precise on-line surface measurement, a synchronic phase-shifting technique is proposed. Its anti-vibration characteristics are analyzed and a vibration table to simulate different vibration conditions is set up, on which many experiments for surface measurement under different vibration conditions are conducted. The analysis and experimental testing verify the excellent anti-vibration characteristics of the interferometer for on-line precise surface measurement.
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