Papers by Keyword: Beyond CMOS

Abstract: Interconnect dimensions and CMOS transistor feature size approach their physical limits, therefore scaling will no longer play an important role in performance improvement. So, instead of trying to improve the performance of traditional CMOS circuits, integration of multiple technologies and different components in a heterogeneous system that is high performance will be introduced “moore than more” and CMOS replacement”beyond CMOS” will be explored. This paper focuses on Technology level trends where it presents “More Moore”:New Architectures (SOI, FinFET, Twin-Well),”More Moore” :New Materials (High-K, Metal Gate, Strained-Si) ,”More than Moore”:New Interconnects Schemes (3D, NoC, Optical, Wireless), and ”Beyond CMOS” :New Devices (Molecular Computer, Biological computer, Quantum Computer) .

Abstract: Requirements and applications for three different scenarios in material science of microelectronics are discussed. Dimension scaling continous at the same pace (More Moore) by changing to immersion lithography and later to extreme ultraviolet lithography. The functionality of system on chip solutions will be increased by heterogeneous technologies combined with a microelectronics core ( More than Moore). Material science and physical understanding of new device principles started well in advance to judge difficulties and options. The strong links to economy are illustrated by a simple model of exponential growth.