Papers by Keyword: Bipolar Diode

Abstract: This paper presents for the first time a comparison between experimental measurements of Optical Beam Induced Current (OBIC) and finite element simulations on high-voltage bipolar diodes. Two peripheral protection structures were chosen: a simple MESA protection and a MESA + JTE combination. Comparable experimental and simulated results were obtained in both cases.

Abstract: This paper presents OBIC measurements performed at near breakdown voltage on two devices with different JTE doses. Overcurrent has been measured either at the JTE periphery or at the P⁺ border. Such overcurrent is present due to the electric field enhancement near the breakdown voltage. This hypothesis is proved by the electroluminescence. TCAD simulation of two different JTE doses yielded similar results to the OBIC measurements.

Abstract: The behavior of 4H-SiC power devices in severe environment with varying temperature is a key characteristic indicating their reliability. This paper shows the dependence of the ionization rates of 4H-SiC with respect to temperature. Optical Beam Induced Current (OBIC) measurements have been performed on PN junctions to determine the multiplication coefficient for temperature varying between 100 and 450K. That allows extracting the ionization rates by fitting the curves of multiplication coefficient.

Abstract: 10 kV class 4H-SiC bipolar diodes have been fabricated. Two different edge terminations (Mesa/JTE or MESA/JTE with JTE rings) with two different junction bend radius have been designed and tested. Measurement results show that the inclusion of JTE rings improve the edge termination efficiency. The measurements indicate also a better reverse performance of diodes with larger bend radius.

Abstract: 4H-SiC vertical bipolar power diodes have been fabricated with bilayer metallic anode contact based on an Al-Ti-Ni ohmic contact and a thick Al over-metallization. An optical window of 100 × 100 μm2 has been created through the anode contact with a SIMS Cameca IMS 4F equipment using Cs+ primary ions at 10 kV and with a beam spot size of 100 nm. The current/voltage characteristics of the diodes show that the SIMS process does not induce an increase of the leakage currents in forward nor in reverse bias. OBIC UV photogeneration occurs under the optical window and not under the contact metal.

Abstract: This paper reports the fabrication and electrical characterization of PiN diodes on an on-axis grown epitaxial layer. TCAD simulations have been performed in order to design their architecture. Some of these diodes have a breakdown voltage around 600 V. A comparison is made with similar diodes fabricated on off-cut grown layers. Computer simulations are used to explain lower breakdown voltage than those expected.

Abstract: We report on specific features of forward voltage degradation of 4H-SiC p-i-n diodes in the pulse mode. It is shown that pulse stresses with a pulse duration shorter than several milliseconds cause substantially smaller forward voltage drift in comparison with a dc stress with the same charge passed through the diodes and the same distribution of injected carriers. A self-recovery of the forward voltage is observed at room temperature.

Abstract: Two different optical measurement techniques have been combined in one single experimental platform to provide detailed insight into the interior of 4H-SiC bipolar devices with respect to their coupled electronic and thermal behavior: First, free carrier absorption (FCA) measurements yield time-resolved electron and hole densities profiles during turn-on and under stationary conditions; and second, light deflection measurements provide information about the gradients of the electron and hole densities as well as that of the temperature gradient. The full measurement process is also simulated on the computer as “virtual experiment” on the basis of high-fidelity physical device models. Investigations on high-blocking 4H-SiC bipolar diodes exemplify the optical probing methodology and the numerical simulation.

Abstract: In this work, the benefits of the low-temperature halo-carbon epitaxial growth at 1300oC to form anodes of 4H-SiC PiN diodes were investigated. Regular-temperature epitaxial growth was used to form an 8.6 μm-thick n-type drift region with net donor concentration of 6.45x1015 cm-3. Trimethylaluminum doping, in situ during blanket low-temperature halo-carbon epitaxial growth, was used to form heavily doped p-type layers. Forward I-V characteristics measured from diodes having different anode areas indicated that the new epitaxial growth technique provides anodes with low values of the series resistance, even without contact annealing. At room temperature, a 100 μm-diameter diode had a forward voltage of 3.75 V at 1000A/cm² before annealing and 3.23 V after annealing for 2 min at 750°C. The reverse breakdown voltage was more than 680 V (on average) in the devices without edge termination or surface passivation.

Abstract: The effect of electron irradiation on the charge collection efficiency of a 6H-SiC p+n diode has been studied. The diodes were irradiated with electrons of energies from 100 keV to 1 MeV. The charge collection efficiencies of the samples were measured for alpha particles before and after the electron irradiation. The electron irradiation at 100 keV does not affect the charge collection efficiency, while the electron irradiation at 200 keV or higher decreases the charge collection efficiency. The degree of the degradation of the diodes correlates with the energy of the electron irradiation.