Papers by Keyword: Center-Anchored Circular Plate

Abstract: Large-scale measurement of material property is not suit for the MEMS thin-film. Research the in-situ measuring method for material property of the MEMS thin-film is urgently. A center-anchored circular plate is adopted as the test structure here. The resonance frequency of the circular plate is measured to extract the Young’s modulus of a MEMS thin-film. The accuracy of this non-contact in-situ measuring method has been verified by CoventorWare. The inferences of the stress gradient have been analyzed. The advantages of the test structure and the measuring method present here also have been discussed.

Abstract: The stress gradient of a deposited thin-film is a mechanical parameter that affects the performance of MEMS devices, so in-situ measuring stress gradient of a thin-film is great significant. A new in-situ measuring method based on a center-anchored circular plate is presented. The Mirau interferometer has been used to measure the out-of-plane height at the edge of circular plate, then the curvature radius of the plate and the stress gradient of the film can be calculated. The measuring method has been verified by CoventorWare. The accuracy of the presented measuring method is ideal. The advantages of the method also have been discussed.