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Papers by Keyword: Copper (Cu)

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Metal Content of Multicrystalline Silicon for Solar Cells and its Impact on Minority Carrier Diffusion Length

Authors: Andrei A. Istratov, Tonio Buonassisi, R.J. McDonald, A.R. Smith, R. Schindler, James Rand, Juris P. Kalejs, Eicke R. Weber

175

Model Studies of Surfaces and Interfaces in Ceramics

Authors: M. Kitayama, Takayuki Narushima, K. Tran, G. Gronsky, Andreas M. Glaeser

341

Strain-Rate Dependence of Dynamic Twin Nucleation at Triple Junction in Copper

Authors: Hiromi Miura, Sutandyo Andiarwanto, Tetsuo Sakai

4387

Microstructures at Aluminum - Copper Magnetic Pulse Weld Interfaces

Authors: Manuel Marya, Didier Priem, Surendar Marya

4001

Modeling the Hot Flow Stress of Commercial Purity Coppers with Different Oxygen Levels

Authors: V.G. García, Jose María Cabrera, Jose Manuel Prado

3921

The Effect of Grain Boundary Characteristics on Microstructure and Stress Void Evolution in Electroplated and Sputtered Cu Films

Authors: Young Chang Joo, Soo Jung Hwang, Hyun Park

3481

Influence of Additives upon Nucleation and Growth of Copper on Titanium Substrates during Electrodeposition

Authors: Kyeong-Won Seol, Byung Hak Choe, Ye Kun Lee, Jong K. Lee

3715

Microstructural Changes in Copper Processed by Equal Channel Angular Extrusion and Static Annealing

Authors: Z. Guo, Denis Solas, Anne Laure Etter, Thierry Baudin, Richard Penelle

2723

Application of Electroless Coating for Processing and Joining of Advanced Materials

Authors: Mathieu Brochu, C.A. León, Robin A.L. Drew

2491

Investigation of Texture in ECAP Materials Using Neutron Diffraction

Authors: Sven C. Vogel, D.J. Alexander, Irene J. Beyerlein, Mark A.M. Bourke, Donald W. Brown, Bjørn Clausen, Carlos Tomé, R.B. Von Dreele, Terence G. Langdon, C. Xu

2661