Papers by Keyword: Cu-Al Plate

Abstract: In this study, the commercial purity Al/Cu plates were bonded through the explosive welding process. The SEM/EBSD local orientation measurements were conducted to consider the changes in the microstructure and the development of texture gradients for the applied explosive loading. A particular attention was paid to the texture changes across the interface. The detailed local orientation measurements show that the ultra-fine grained layers are formed close to the bonding zone. The layers were characterized by the copper-type rolling texture components. The interface was outlined by a characteristic sharp transition between the two materials. However, in some places, local melted zones were also encountered, mainly in the front slope of the waves.

Abstract: This paper is concerned with pressure welding, which has been known as a main bonding mechanism during the cold and warm formings such as clad extrusion or bundle extrusion/drawing. Bonding characteristics between the Cu and Al plates by pressure welding are investigated focusing on the weak bonding. Experiments are performed at the cold and warm temperatures ranging from the room temperature to 200°C. The important factors examined in this work are the welding pressure, pressure holding time, surface roughness, and temperature. A bonding map, which can identify the bonding criterion with a weak bonding strength of 1MPa , is proposed in terms of welding pressure and surface roughness for the cold and warm temperature ranges.